Full Name
Wu, Jianhua
Variants
Wu, J.H.
Wu, J.
 
 
 

Publications

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Type:  Article
Date Issued:  [2000 TO 2009]

Results 1-1 of 1 (Search time: 0.003 seconds).

Issue DateTitleAuthor(s)
12000Effect of delamination on the thermal fatigue of solder joints in flip chipsOng, E.T.; Tay, A.A.O. ; Wu, J.H.