1. ScholarBank@NUS

Tay Ah Ong,Andrew

rp08084

Collaboration Map View Statistics Email Alert RSS Feed

Profile

Full Name
Tay Ah Ong,Andrew
(not current staff)
Variants
Tay, A.
Tay, A.O.A.
Tay, Ah Ong Andrew
Tay, A.A.O.
TAY, ANDREW AH ONG
Tay, A.O.
Tay, Andrew A.O.
Ong, A.T.A.
 
Main Affiliation
 
Faculty
 
Email
mpetayao@nus.edu.sg
 

Publications

Results 201-211 of 211 (Search time: 0.003 seconds).

Issue DateTitleAuthor(s)
2012006The role of simulation in failure prediction and design optimization in electronics packagingTay, A.A.O. 
20216-Mar-2014The theoretical modelling and optimization of a 10 KWP photovoltaic thermal system for a student hostel in SingaporeDubey, S. ; Tay, A.A.O. 
2032012Thermal analysis of high-powered devices using analytical and experimental methodsLing, J.H.L.; Tay, A.A.O. ; Choo, K.F.
2042012Thermal characterization and modelling of a gallium arsenide power amplifier MMICLing, J.H.L.; Tay, A.A.O. ; Choo, K.F.; Chen, W.
2052002Transient three dimensional simulation of mold filling and wire sweep in an overmold BGA packageTay, A.A.O. ; Lee, W.H.
2062004Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnectsAggarwal, A.O.; Raj, P.M.; Sacks, M.D.; Tay, A.A.O. ; Tummala, R.R.
2072000Unified micromechanical model for estimating elastic, elasto-plastic and strength behaviors of knitted fabric reinforced compositesHuang, Z.M. ; Ramakrishna, S. ; Tay, A.A.O. 
2082013Versatile pattern generation of periodic, high aspect ratio Si nanostructure arrays with sub-50-nm resolution on a wafer scaleHo, J.-W.; Wee, Q.; Dumond, J.; Tay, A. ; Chua, S.-J. 
2092012Wafer-scale, highly-ordered silicon nanowires produced by step-and-flash imprint lithography and metal-assisted chemical etchingHo, J.-W.; Wee, Q.; Dumond, J.; Zhang, L.; Zang, K.; Choi, W.K. ; Tay, A.A.O. ; Chua, S.-J. 
210Mar-1995Wirebond deformation during molding of IC packagesTay, A.A.O. ; Yeo, K.S. ; Wu, J.H. ; Lim, T.B. 
2111993Wirebound deformation during molding of IC packagesTay, A.A.O. ; Yeo, K.S. ; Wu, J.H. ; Lim, T.B.