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Tay Ah Ong,Andrew

rp08084

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Full Name
Tay Ah Ong,Andrew
(not current staff)
Variants
Tay, A.
Tay, A.O.A.
Tay, Ah Ong Andrew
Tay, A.A.O.
TAY, ANDREW AH ONG
Tay, A.O.
Tay, Andrew A.O.
Ong, A.T.A.
 
Main Affiliation
 
Faculty
 
Email
mpetayao@nus.edu.sg
 

Publications

Results 21-40 of 211 (Search time: 0.006 seconds).

Issue DateTitleAuthor(s)
212004A numerical study of the effects of temperature, moisture and vapour pressure on delamination in a PQFP during solder reflowGuojun, H.; Tay, A.A.O. 
22Mar-1993A review of methods of calculating machining temperatureTay, A.A.O. 
232005A slim sector model for the analysis of fatigue life of fine pitch flip chip packagesZhao, B.; Tay, A.A.O. 
242004A slim sector model for the analysis of solder joint reliabilityZhao, B.; Tay, A.A.O. 
252007A Study of compressively strained Si0.5Ge0.5 metal-oxide-semiconductor capacitors with chemical vapor deposition HfAlO as gate dielectricHuang, J.; Fu, J.; Zhu, C. ; Tay, A.A.O. ; Cheng, Z.-Y.; Leitz, C.W.; Lochtefeld, A.
26Dec-2003A study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflowTay, A.A.O. ; Goh, K.Y.
27Jun-2012A study of intermittent spray cooling process through application of a sequential function specification methodSomasundaram, S.; Tay, A.A.O. 
282010A study of the effect of exit boundary conditions on the performance of a spray cooling systemSomasundaram, S.; Tay, A.A.O. 
292007A study of the effect of viscoelasticity on delamination in a plastic IC package undergoing leadfree solder reflowGuojun, H.H.; Tay, A.A.O. ; Yongwei, Z.; Chew, S.
30Aug-2005A study on microstructural and mechanical properties of nanocrystalline nickelMohankumar, K.; Shyong, S.K. ; Jayaganthan, R. ; Tay, A.A.O. ; Kripesh, V. 
312004A study on the mechanical behavior of the sputtered nickel thin Films for UBM applicationsSekhar, V.N.; Srinivasarao, V.; Jayaganthan, R. ; Mohankumar, K.; Tay, A.A.O. 
321-Sep-2006A thick photoresist process for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresistRao, V.S.; Kripesh, V.; Yoon, S.W.; Tay, A.A.O. 
33Feb-1998A three-dimensional modeling of wire sweep incorporating resin cureWu, J.H.; Tay, A.A.O. ; Yeo, K.S. ; Lim, T.B.
342013Accurate thermal characterization of a GaN PA MMIC using Thermoreflectance thermographyLing, J.H.L.; Tay, A.A.O. ; Choo, K.F.
352008An effective method for calculation of corner stresses with applications to plastic IC packagesZhou, W.; Lim, K.-M. ; Tay, A.A.O. 
362004An effective method for calculation of corner stresses with applications to plastic IC packagesWei, Z.; Meng, L.K. ; Tay, A. 
371-Mar-2014An electro-thermal model and its application on a spiral-wound lithium ion battery with porous current collectorsYe, Y.; Shi, Y.; Saw, L.H.; Tay, A.A.O. 
382006An experimental study of air and mist cooling of microchannels on IC chipsTay, A.A.O. ; Ang, S.S.T.; Lwin, L.O.
39Oct-2011An experimental study of closed loop intermittent spray cooling of ICsSomasundaram, S.; Tay, A.A.O. 
402006An experimental study of slot-jet impingement and mist cooling of microprocessorsTay, A.A.O. ; Ang, S.S.T.; Lwin, L.O.