| | Issue Date | Title | Author(s) |
| 1 | Oct-2008 | C*-controlled creep crack growth by grain boundary cavitation | Tang, S. ; Guo, T.F. ; Cheng, L. |
| 2 | Nov-2008 | Creep fracture toughness using conventional and cell element approaches | Tang, S. ; Guo, T.F. ; Cheng, L. |
| 3 | Feb-2009 | Dynamic toughness in elastic nonlinear viscous solids | Tang, S. ; Guo, T.F. ; Cheng, L. |
| 4 | Oct-2006 | Effects of pressure-sensitivity and plastic dilatancy on void growth and interaction | Chew, H.B.; Guo, T.F. ; Cheng, L. |
| 5 | 1-Aug-2010 | Humidity-driven bifurcation in a hydrogel-actuated nanostructure: A three-dimensional computational analysis | Wong, W.H.; Guo, T.F.; Zhang, Y.W. ; Cheng, L. |
| 6 | 1-Aug-2010 | Humidity-driven bifurcation in a hydrogel-actuated nanostructure: A three-dimensional computational analysis | Wong, W.H.; Guo, T.F.; Zhang, Y.W. ; Cheng, L. |
| 7 | 2008 | Influence of nonuniform initial porosity distribution on adhesive failure in electronic packages | Chew, H.B.; Guo, T.F. ; Cheng, L. |
| 8 | 2007 | Influence of vapor pressure on rate-dependent void growth in IC packages | Wong, W.H.; Guo, T.F. ; Cheng, L. |
| 9 | 2007 | Influence of vapor pressure on rate-dependent void growth in IC packages | Wong, W.H.; Guo, T.F. ; Cheng, L. |
| 10 | Feb-2003 | Interface delamination in plastic IC packages induced by thermal loading and vapor pressure - A micromechanics model | Liu, P.; Cheng, L. ; Zhang, Y.-W. |
| 11 | 1-May-2008 | Mode mixity and nonlinear viscous effects on toughness of interfaces | Tang, S. ; Guo, T.F. ; Cheng, L. |
| 12 | 1-May-2008 | Mode mixity and nonlinear viscous effects on toughness of interfaces | Tang, S. ; Guo, T.F. ; Cheng, L. |
| 13 | 2006 | Modeling adhesive failure in electronic packages | Chew, H.B.; Guo, T.F. ; Cheng, L. |
| 14 | Apr-2007 | Pressure-sensitive ductile layers - I. Modeling the growth of extensive damage | Chew, H.B.; Guo, T.F. ; Cheng, L. |
| 15 | Apr-2007 | Pressure-sensitive ductile layers - I. Modeling the growth of extensive damage | Chew, H.B.; Guo, T.F. ; Cheng, L. |
| 16 | 1-Aug-2007 | Pressure-sensitive ductile layers - II. 3D models of extensive damage | Chew, H.B.; Guo, T.F. ; Cheng, L. |
| 17 | 1-Aug-2007 | Pressure-sensitive ductile layers - II. 3D models of extensive damage | Chew, H.B.; Guo, T.F. ; Cheng, L. |
| 18 | 2007 | Rate dependent interface delamination in plastic IC packages | Tang, S. ; Guo, T.F. ; Cheng, L. |
| 19 | 2007 | Rate dependent interface delamination in plastic IC packages | Tang, S. ; Guo, T.F. ; Cheng, L. |
| 20 | Mar-2008 | Rate effects on toughness in elastic nonlinear viscous solids | Tang, S. ; Guo, T.F. ; Cheng, L. |