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Yeo Khoon Seng

rp06806

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Profile

Full Name
Yeo Khoon Seng
(not current staff)
Variants
Yeo, K.S.
Seng Yeo, K.
 
Main Affiliation
 
Faculty
 
Email
mpeyeoks@nus.edu.sg
 

Publications

Results 81-95 of 95 (Search time: 0.005 seconds).

Issue DateTitleAuthor(s)
81Jul-1994The Linear Stability of Boundary-Layer Flow over Compliant Walls-The Effects of the Wall Mean State, Induced by Flow LoadingYeo, K.S. ; Khoo, B.C. ; Chong, W.K. 
82Sep-2003The merging of two gaseous bubbles with an application to underwater explosions to underwater explosionsRungsiyaphornrat, S.; Klaseboer, E.; Khoo, B.C. ; Yeo, K.S. 
8330-Oct-1999The numerical simulations of explosion and implosion in air: Use of a modified Harten's TVD schemeLiu, T.G.; Khoo, B.C. ; Yeo, K.S. 
84Mar-2001The simulation of compressible multi-medium flow II. applications to 2D underwater shock refractionLiu, T.G.; Khoo, B.C. ; Yeo, K.S. 
85Mar-2001The simulation of compressible multi-medium flow. I. A new methodology with test applications to 1D gas-gas and gas-water casesLiu, T.G.; Khoo, B.C. ; Yeo, K.S. 
86May-1994The Stability of Flow Over Periodically Supported Plates-Potential FlowYeo, K.S. ; Lim, C.W.
8710-Oct-1998Three-Dimensional Computation of Bubbles Near a Free SurfaceZhang, Y.L. ; Yeo, K.S. ; Khoo, B.C. ; Chong, W.K. 
88Dec-1994Triple-region structure for turbulent flow in a square duct: A finite element approachWang, F.M.; Khoo, B.C. ; Chew, Y.T. ; Yeo, K.S. 
8925-Dec-2001Turbulent boundary layer over a compliant surface: Absolute and convective instabilitiesYeo, K.S. ; Zhao, H.Z.; Khoo, B.C. 
9028-Sep-2003Underwater shock-free surface-structure interactionLiu, T.G.; Khoo, B.C. ; Yeo, K.S. ; Wang, C. 
91Feb-1997Vortex breakdown in an unconfined vortical flowKhoo, B.C. ; Yeo, K.S. ; Lim, D.F.; He, X.
92Oct-2005Vortex ring modelling of toroidal bubblesWang, Q.X.; Yeo, K.S. ; Khoo, B.C. ; Lam, K.Y. 
93Jul-2007Wake-structure formation of a heaving two-dimensional elliptic airfoilLua, K.B. ; Lim, T.T. ; Yeo, K.S. ; Oo, G.Y.
14Mar-1995Wirebond deformation during molding of IC packagesTay, A.A.O. ; Yeo, K.S. ; Wu, J.H. ; Lim, T.B. 
151993Wirebound deformation during molding of IC packagesTay, A.A.O. ; Yeo, K.S. ; Wu, J.H. ; Lim, T.B.