MA YIYI

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Full Name

MA YIYI

Variants

Yi Ma, Y.
Ma, Y.
Ma, Y.Y.

Main Affiliation

MECHANICAL ENGINEERING

Faculty

COLLEGE OF DESIGN AND ENGINEERING

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Type: Conference Paper

Results 1-5 of 5 (Search time: 0.013 seconds).

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	Issue Date	Title	Author(s)
1	2004	A numerical and experimental study of delamination of polymer-metal interfaces in plastic packages at solder reflow temperatures	Tay, A.A.O. ; Ma, Y. ; Nakamura, T.; Ong, S.H.
2	2004	Determination of critical defect size for delamination failure of the pad/encapsulant interface of plastic IC packages undergoing solder reflow	Tay, A.A.O. ; Ma, Y.Y.
3	2000	Failure of polymer-metal interfaces under hygrothermal loading	Tay, A.A.O. ; Ma, Y. ; Ong, S.H.
4	1999	Measurement of interface toughness as a function of temperature, moisture concentration and mode mixity	Tay, A.A.O. ; Yi Ma, Y. ; Huat Ong, S.; Nakamura, T.
5	2005	The effect of moisture on the critical defect size for delamination failure at the pad/encapsulant interface of plastic IC packages undergoing solder reflow	Tay, A.A.O. ; Ma, Y.Y. ; Hu, G.J.