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Ang,Simon Saw-Teong

rp04133

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Full Name
Ang,Simon Saw-Teong
(not current staff)
Variants
Ang, S.S.
Ang, S.
ANG, SIMON SAW-TEONG
ANG, SIMON S.
ANG, SIMON S
 
Main Affiliation
 
Faculty
 
Email
bieangs@nus.edu.sg
 

Publications

Refined By:
Author:  Tay, A.A.O.

Results 1-7 of 7 (Search time: 0.005 seconds).

Issue DateTitleAuthor(s)
119-Aug-2003Characterization of electrolessly deposited copper and nickel nanofilms on modified Si(100) surfaceZhang, Y. ; Ang, S.S. ; Tay, A.A.O. ; Xu, D.; Kang, E.T. ; Neoh, K.G. ; Chong, L.P.; Huan, A.C.H.
2May-2004Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-packageTay, A.A.O. ; Iyer, M.K.; Tummala, R.R.; Kripesh, V.; Wong, E.H.; Swaminathan, M.; Wong, C.P.; Rotaru, M.D.; Doraiswami, R.; Ang, S.S. ; Kang, E.T. 
3May-2004Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-packageTay, A.A.O. ; Iyer, M.K.; Tummala, R.R.; Kripesh, V.; Wong, E.H.; Swaminathan, M.; Wong, C.P.; Rotaru, M.D.; Doraiswami, R.; Ang, S.S. ; Kang, E.T. 
4May-2006Numerical analysis on compliance and electrical behavior of multi-copper-column flip-chip interconnects for wafer-level packagingLiao, E.B.; Tay, A.A.O. ; Ang, S.S. ; Feng, H.H.; Nagarajan, R.; Kripesh, V.
57-Sep-2006Planar microspring integrated circuit chip interconnection to next levelTAY, ANDREW AH ONG ; ANG, SIMON SAW-TEONG ; LIAO, EBIN
65-Dec-2002Selective electroless plating of copper on (100)-oriented single crystal silicon surface modified by UV-induced coupling of 4-vinylpyridine with the H-Terminated siliconXu, D.; Kang, E.T. ; Neoh, K.G. ; Zhang, Y. ; Tay, A.A.O. ; Ang, S.S. ; Lo, M.C.Y.; Vaidyanathan, K.
72004Surface micromachined pressure sensing structures with biocompatible interfaceLiao, E.; Ang, S. ; Ong, A.T.A. ; Liang, Y.C. ; Jin, A.Y.U.