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Kui Liu

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Full Name
Kui Liu
Variants
Liu, K.
 
Main Affiliation
 
Faculty
 
Email
mpeliuku@nus.edu.sg
 

Publications

Refined By:
Date Issued:  [2000 TO 2023]

Results 1-17 of 17 (Search time: 0.006 seconds).

Issue DateTitleAuthor(s)
115-Jun-2001A new method for determining the undeformed chip thickness in millingLi, H.Z.; Liu, K. ; Li, X.P. 
22018A review on ductile mode cutting of brittle materialsAntwi, E.K; Liu, K ; Wang, H 
3Aug-2003CBN tool wear in ductile cutting of tungsten carbideLiu, K. ; Li, X.P. ; Rahman, M. ; Liu, X.D.
422-Sep-2003Characteristics of high speed micro-cutting of tungsten carbideLiu, K. ; Li, X.P. ; Rahman, M. 
515-Jun-2001Ductile cutting of tungsten carbideLiu, K. ; Li, X.P 
62002Effect of cutting edge radius on ductile-brittle transition in cutting of silicon-wafersLi, X.P. ; Chan, C.C.; Liu, K. ; Rahman, M. ; Liu, X.D.
72020Investigation of electrochemical oxidation behaviors and mechanism of single-crystal silicon (100) wafer under potentiostatic modeGuo, W.; Anantharajan, S.K.; Liu, K. ; Deng, H.
822-Sep-2003Nano-precision measurement of diamond tool edge radius for wafer fabricationLi, X.P. ; Rahman, M. ; Liu, K. ; Neo, K.S. ; Chan, C.C.
92003Nanometer scale ductile cutting of tungsten carbideLiu, K. ; Li, X. ; Liang, S.Y.
102004Nanometer scale ductile mode cutting of soda-lime glassLiu, K. ; Li, X. ; Liang, S.Y.; Liu, X.D.
112004Nanometer-scale ductile cutting of tungsten carbideLiu, K. ; Li, X. ; Liang, S.Y.
122005Nanometer-scale, ductile-mode cutting of soda-lime glassLiu, K. ; Li, X. ; Liang, S.Y.; Liu, X.D.
132009Numerical and experimental analysis of the tool edge radius effect in micromachining of ferrous materialsWoon, K.-S.; Rahman, M. ; Liu, K. 
1430-Apr-2007Performance of single crystal diamond tools in ductile mode cutting of siliconUddin, M.S.; Seah, K.H.W. ; Rahman, M. ; Li, X.P. ; Liu, K. 
152004Study of ductile mode cutting in grooving of tungsten carbide with and without ultrasonic vibration assistanceLiu, K. ; Li, X.P. ; Rahman, M. ; Liu, X.D.
162007The effect of the cutting edge radius on a machined surface in the nanoscale ductile mode cutting of silicon waferArefin, S.; Li, X.P. ; Cai, M.B.; Rahman, M. ; Liu, K. ; Tay, A. 
17Jan-2007The upper bound of tool edge radius for nanoscale ductile mode cutting of silicon waferArefin, S.; Li, X.P. ; Rahman, M. ; Liu, K.