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Chengkuo Lee

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Full Name
Chengkuo Lee
Variants
Lee, C.-K.
Lee Chengkuo
Chengkuo, L.
Lee, C.
Lee, C.K.
Lee Chengkun
Lee Cheng Kuo
Lee, Vincent Ch
Vincent Lee
 
Main Affiliation
 
Faculty
 
Email
elelc@nus.edu.sg
 

Publications

Refined By:
Date Issued:  [2000 TO 2009]

Results 1-20 of 23 (Search time: 0.012 seconds).

Issue DateTitleAuthor(s)
1Feb-2007A MEMS VOA using electrothermal actuatorsLee, C. 
2Dec-2005Arrayed variable optical attenuator using retro-reflective MEMS mirrorsLee, C. 
32009Bilayer graphene nanoribbon nanoelectromechanical system device: A computational studyLam, K.-T.; Lee, C. ; Liang, G. 
42008Biomicrofluidic lab-on-chip device for cancer cell detectionHe, J.H.; Reboud, J.; Ji, H.; Zhang, L.; Long, Y.; Lee, C. 
519-Oct-2009Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallizationYu, D.-Q.; Lee, C. ; Yan, L.L.; Thew, M.L.; Lau, J.H.
631-Aug-2009Characterization of intermediate In/Ag layers of low temperature fluxless solder based wafer bonding for MEMS packagingLee, C. ; Yu, A.; Yan, L.; Wang, H.; He, J.H.; Zhang, Q.X.; Lau, J.H.
71-Apr-2008Design and modeling of a nanomechanical sensor using silicon photonic crystalsLee, C. ; Radhakrishnan, R.; Chen, C.-C.; Li, J.; Thillaigovindan, J.; Balasubramanian, N.
82008Development and evolution of MOEMS technology in variable optical attenuatorsLee, C. ; Yeh, J.A.
91-Apr-2006Development of electrothermal actuation based planar variable optical attenuators (VOAs)Lee, C. ; Andrew Yeh, J.
102008Development of wafer level packaged scanning micromirrorsYu, A.; Lee, C. ; Yan, L.L.; Zhang, Q.X.; Yoon, S.U.; Lau, J.H.
112009Electromagnetic energy harvesting from vibrations of multiple frequenciesYang, B.; Lee, C. ; Xiang, W. ; Xie, J.; Han He, J.; Kotlanka, R.K.; Low, S.P.; Feng, H.
12Aug-2002Enhancing the tensile modulus and strength of an aluminum alloy using interconnected reinforcement methodologyGanesh, V.V.; Lee, C.K. ; Gupta, M. 
1315-Mar-2006MOEMS variable optical attenuator with improved dynamic characteristics based on robust designLee, C. 
1415-May-2006MOEMS variable optical attenuators using rotary comb drive actuatorsYeh, J.A.; Jiang, S.-S.; Lee, C. 
15Jul-2006Novel H-beam electrothermal actuators with capability of generating bi-directional static displacementLee, C. 
161-Apr-2009Optical nanomechanical sensor using a silicon photonic crystal cantilever embedded with a nanocavity resonatorChengkuo, L. ; Thillaigovindan, J.
172008Si nanophotonics based cantilever sensorLee, C. ; Thillaigovindan, J.; Chen, C.-C.; Chen, X.T.; Chao, Y.-T.; Tao, S.; Xiang, W. ; Yu, A.; Feng, H.; Lo, G.Q.
18Feb-2009Study of low-temperature thermocompression bonding in Ag-In solder for packaging applicationsMade, R.I.; Gan, C.L.; Yan, L.L.; Yu, A.; Yoon, S.W.; Lau, J.H.; Lee, C. 
1915-Jul-2009The comparison between the graded photonic crystal coupler and various couplersChien, H.-T.; Lee, C. ; Chiu, H.-K.; Hsu, K.-C.; Chen, C.-C.; Ho, J.-A.A.; Chou, C.
202009The role of Ni buffer layer on high yield low temperature hermetic wafer bonding using In/Sn/Cu metallizationYu, D.-Q.; Lee, C. ; Yan, L.L.; Choi, W.K.; Yu, A.; Lau, J.H.