Full Name
LEE CHENGKUO
Variants
Lee, C.-K.
Lee Chengkuo
Chengkuo, L.
Lee, C.
Lee, C.K.
Lee Chengkun
Lee Cheng Kuo
Lee, Vincent Ch
 
 
 
Email
elelc@nus.edu.sg
 

Publications

Refined By:
Date Issued:  [2000 TO 2009]

Results 1-20 of 57 (Search time: 0.005 seconds).

Issue DateTitleAuthor(s)
1Sep-2009A 1-V operated MEMS variable optical attenuator using piezoelectric PZT thin-film actuatorsLee, C. ; Hsiao, F.-L. ; Kobayashi, T.; Koh, K.H.; Ramana, P.V.; Xiang, W. ; Yang, B.; Tan, C.W.; Pinjala, D.
2Sep-2009A 2-D MEMS Scanning Mirror Using Piezoelectric PZT Beam ActuatorsKoh, K.H.; Kobayashi, T.; Hsiao, F.-L. ; Lee, C. 
32008A hermetic chip to chip bonding at low temperature with Cu/In/Sn/Cu jointYan, L.; Lee, C. ; Yu, D.; Choi, W.K.; Yu, A.; Yoon, S.U.; Lau, J.H.
4Jan-2009A hermetic seal using composite thin-film In/Sn solder as an intermediate layer and its interdiffusion reaction with CuYan, L.-L.; Lee, C.-K. ; Yu, D.-Q.; Yu, A.-B.; Choi, W.-K.; Lau, J.-H.; Yoon, S.-U.
5Feb-2007A MEMS VOA using electrothermal actuatorsLee, C. 
62009A nano-ring resonator based on 2-D hexagonal-lattice photonic crystalsHsiao, F.-L. ; Lee, C. 
72009A wideband electromagnetic energy harvester for random vibration sourcesYang, B.; Lee, C. 
82008Analysis of racetrack resonators in surface sensing applicationKargar, A.; Lee, C. 
9Dec-2005Arrayed variable optical attenuator using retro-reflective MEMS mirrorsLee, C. 
102007Assembly of single cells array using image dielectrophoresisLu, Y.S.; Liang, Y.L.; Huang, Y.P.; Huang, J.Y.; Lee, C. ; Yen, J.A.
112009Bilayer graphene nanoribbon nanoelectromechanical system device: A computational studyLam, K.-T.; Lee, C. ; Liang, G. 
122008Biomicrofluidic lab-on-chip device for cancer cell detectionHe, J.H.; Reboud, J.; Ji, H.; Zhang, L.; Long, Y.; Lee, C. 
132008Bonding interface materials evolution of intermediate In/Ag layers for low temperature fluxless solder based MEMS wafer level packagingLee, C. ; Yu, D.; Yu, A.; Yan, L.; Wang, H.; Lau, J.H.
1419-Oct-2009Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallizationYu, D.-Q.; Lee, C. ; Yan, L.L.; Thew, M.L.; Lau, J.H.
1531-Aug-2009Characterization of intermediate In/Ag layers of low temperature fluxless solder based wafer bonding for MEMS packagingLee, C. ; Yu, A.; Yan, L.; Wang, H.; He, J.H.; Zhang, Q.X.; Lau, J.H.
162009Computational study of an optical NEMS sensorLee, C. ; Xiang, W. ; Hsiao, F.-L. 
171-Apr-2008Design and modeling of a nanomechanical sensor using silicon photonic crystalsLee, C. ; Radhakrishnan, R.; Chen, C.-C.; Li, J.; Thillaigovindan, J.; Balasubramanian, N.
182007Design and modeling of nanomechanical sensors using silicon 2-D photonic crystalsLee, C. ; Thillaigovindan, J.; Radhakrishnan, R.
192008Design and modeling of nanophotonic beam structures as optical NEMS sensorsLee, C. ; Thillaigovindan, J.; Yu, A.; Radhakrishnan, R.; Chen, C.-C.; Chao, Y.-T.; Lau, J.H.
202008Design and modeling of vacuum packaged MEMS thermoelectric power generator using heat dissipation pathXie, J.; Lee, C.