Organization name
MATERIALS SCIENCE


Results 1-20 of 971 (Search time: 0.013 seconds).

Issue DateTitleAuthor(s)
1Aug-1999α-Fe2O3 powder of nanosized particles via precursor dispersionLiu, X.; Ding, J. ; Wang, J. 
21999Zooming in on clusters: Novel behaviour of supported metal nanocrystalsYeadon, M. ; Yang, J.C.; Ghaly, M.; Nordlund, K.; Averback, R.S.; Murray, G.J.
33-Nov-2004Zirconia catalysts in meerwein-ponndorf-verley reduction of citralZhu, Y.; Liu, S. ; Jaenicke, S. ; Chuah, G. 
4Oct-2005XPS study of thermal effects on FePt and FePtAg nanoparticlesSong, T.; Zhou, T.; Chen, C.; Gong, H. 
52005XPS study of thermal effects on FePt and FePtAg nanoparticlesSong, T.; Zhou, T.J.; Chen, C.L.; Gong, H. 
61-May-2000XPS investigation of the oxidation/corrosion of melt-spun MgYao, H.B.; Li, Y. ; Wee, A.T.S. 
720-Jan-2002X-ray analysis and microhardness characterization of TiN/Ti multilayersLi, W. ; Gong, H. ; Cai, J. ; Wang, Y.
86-Jan-2006Water-soluble quantum dots as biological labelsLU TING
92-Dec-2004Water-soluble CdS quantum dots prepared from a refluxing single precursor in aqueous solutionZhang, Z.H. ; Chin, W.S. ; Vittal, J.J. 
1027-Nov-2003WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIPLU, HAIJING; GONG, HAO ; WONG, CHEE KHUEN STEPHEN
119-Mar-2005WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIPLU, HAIJING; GONG, HAO ; WONG, CHEE KHUEN STEPHEN
121-Jun-2005Viscoelastic modeling of template-directed DNA synthesisStengel, G.; Höök, F.; Knoll, W. 
131998Variation of the relative permittivity of charged dielectricsOng, C.K. ; Song, Z.G.; Oh, K.H. ; Gong, H. ; Le Gressus, C.
142001Variation in mechanical properties with crystallinity of a La-based bulk metallic glassRamamurty, U.; Nagendra, N.; Li, Y. 
15Jul-2003Vapor pressure assisted void growth and cracking of polymeric films and interfacesCheng, L. ; Guo, T.F. 
162003Vapor pressure assisted interface delamination and failure of plastic IC packages - A micromechanics approachChong, C.W.; Guo, T.F. ; Cheng, L. 
17Aug-2004Vapor pressure assisted crack growth at interfaces under mixed mode loadingChong, C.W.; Guo, T.F. ; Cheng, L. 
18Jun-2003Vapor pressure and void size effects on failure of a constrained ductile filmGuo, T.F. ; Cheng, L. 
19Nov-2004Vapor pressure and residual stress effects on the toughness of polymeric adhesive jointsChew, H.B.; Guo, T.F. ; Cheng, L. 
20Aug-2005Vapor pressure and residual stress effects on mixed mode toughness of an adhesive filmChew, H.B.; Guo, T.F. ; Cheng, L.