Browsing by Author Tummala, R.R.

Showing results 1 to 8 of 8
Issue DateTitleAuthor(s)
2005Design and development of interconnects for ultra-fine pitch wafer level packagesTay, A.A.O. ; Iyer, M.K.; Tummala, R.R.
May-2008Development of stretch solder interconnections for wafer level packagingRajoo, R.; Lim, S.S.; Wong, E.H.; Hnin, W.Y.; Seah, S.K.W.; Tay, A.A.O. ; Iyer, M.; Tummala, R.R.
2004Material synthesis routes for thin film bonding interfaces in reworkable and bumpless nano-interconnectsAggarwal, A.O.; Raj, P.M.; Abothu, I.R.; Ravi, D.; Sacks, M.D.; Tay, A.A.O. ; Tummala, R.R.
2004New paradigm in IC-package interconnections by reworkable nano-interconnectsAggarwal, A.O.; Raj, P.M.; Abothu, I.R.; Sacks, M.D.; Tay, A.A.O. ; Tummala, R.R.
May-2004Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-packageTay, A.A.O. ; Iyer, M.K.; Tummala, R.R.; Kripesh, V.; Wong, E.H.; Swaminathan, M.; Wong, C.P.; Rotaru, M.D.; Doraiswami, R.; Ang, S.S. ; Kang, E.T. 
May-2004Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-packageTay, A.A.O. ; Iyer, M.K.; Tummala, R.R.; Kripesh, V.; Wong, E.H.; Swaminathan, M.; Wong, C.P.; Rotaru, M.D.; Doraiswami, R.; Ang, S.S. ; Kang, E.T. 
2006Super stretched solder interconnects for wafer level packagingRajoo, R.; Wong, E.H.; Lim, S.S.; Hnin, W.Y.; Seah, S.K.W.; Tay, A.A.O. ; Iyer, M.; Tummala, R.R.
2004Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnectsAggarwal, A.O.; Raj, P.M.; Sacks, M.D.; Tay, A.A.O. ; Tummala, R.R.