Browsing by Author Osiyemi, S.

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Issue DateTitleAuthor(s)
Oct-2005Chemothermal modeling and finite-element analysis for microwave cure process of underfill in flip-chip packagingLiu, L. ; Yi, S.; Ong, L.S.; Chian, K.S.; Osiyemi, S.; Lim, S.H.; Su, F.