Browsing by Author Lai, D.M.Y.

Showing results 1 to 16 of 16
Issue DateTitleAuthor(s)
2008Band edge NMOS work function for nickel fully-silicided (FUSI) gate obtained by the insertion of novel Y-, Tb-, and Yb-based interlayersLim, A.E.-J.; Lee, R.T.P. ; Wang, X.P.; Hwang, W.S.; Tung, C.-H.; Lai, D.M.Y.; Samudra, G. ; Kwong, D.-L.; Yeo, Y.-C. 
Aug-2002Characterization of fluoropolymer films deposited by magnetron sputtering of poly(tetrafluoroethylene) and plasma polymerization of heptadecafluoro-1-decene (HDFD) on (100)-oriented single-crystal silicon substratesZhang, Y. ; Yang, G.H.; Kang, E.T. ; Neoh, K.G. ; Huang, W. ; Huan, A.C.H. ; Lai, D.M.Y.
28-Apr-2006Effect of germanium concentration and oxide diffusion barrier on the formation and distribution of germanium nanocrystals in silicon oxide matrixChew, H.G.; Choi, W.K. ; Foo, Y.L.; Zheng, F.; Chim, W.K. ; Voon, Z.J.; Seow, K.C.; Fitzgerald, E.A.; Lai, D.M.Y.
2008Enhanced Ge MOS device performance through a novel post-gate CF 4-plasma treatment processXie, R.; Thamarai, M.; Sun, Z.; Yu, M.; Lai, D.M.Y.; Chan, L.; Zhu, C. 
2006Germanium incorporation in Hf O2 dielectric on germanium substrateZhang, Q.; Wu, N.; Lai, D.M.Y.; Nikolai, Y.; Bera, L.K.; Zhu, C. 
2007Incorporation of tin in boron doped silicon for reduced deactivation of boron during post-laser-anneal rapid thermal processingLiu, F.; Tan, K.-M.; Wang, X.; Low, D.K.Y.; Lai, D.M.Y.; Lim, P.C.; Samudra, G. ; Yeo, Y.-C. 
2007Metal-gate work function modulation using hafnium alloys obtained by the interdiffusion of thin metallic layersLim, A.E.-J.; Hwang, W.S.; Wang, X.P.; Lai, D.M.Y.; Samudra, G.S. ; Kwong, D.-L.; Yeo, Y.-C. 
1-Apr-2004Miscibility and Surface Properties of Fluorinated Copolymer Blends Involving Hydrogen-Bonding InteractionsHuang, H.L.; Goh, S.H. ; Lai, D.M.Y.; Wee, A.T.S. ; Huan, C.H.A. 
Jan-2008Nickel-silicide: Carbon contact technology for N-channel MOSFETs with silicon-carbon source/drainLee, R.T.P. ; Yang, L.-T.; Liow, T.-Y.; Tan, K.-M.; Lim, A.E.-J.; Ang, K.-W.; Lai, D.M.Y.; Hoe, K.M.; Lo, G.-Q.; Samudra, G.S. ; Chi, D.Z.; Yeo, Y.-C. 
2006Novel nickel-alloy suicides for source/drain contact resistance reduction in N-channel multiple-gate transistors with sub-35nm gate lengthLee, R.T.P. ; Liow, T.-Y.; Tan, K.-M.; Lim, A.E.-J.; Wong, H.-S.; Lim, P.-C.; Lai, D.M.Y.; Lo, G.-Q.; Tung, C.-H.; Samudra, G. ; Chi, D.-Z.; Yeo, Y.-C. 
2002Plasma polymerization of allylpentafluorobenzene on copper surfacesYang, G.H.; Zhang, Y. ; Kang, E.T. ; Neoh, K.G. ; Huan, A.C.H. ; Lai, D.M.Y.
8-Aug-2006Preparation of polymer-silicon(100) hybrids via interface-initiated reversible addition-fragmentation chain-transfer (RAFT) polymerizationPeng, Q. ; Lai, D.M.Y.; Kang, E.T. ; Neoh, K.G. 
24-Jun-2003Surface characterization of C60-Containing poly(ethyl methacrylate)/poly(ethyl methacrylate) blendsHuang, H.L.; Goh, S.H. ; Zheng, J.W.; Lai, D.M.Y.; Huan, C.H.A. 
30-Mar-2004Surface modification of SiLK® by graft copolymerization with 4-vinylpyridine for reduction in copper diffusionZhu, Y.Q.; Kang, E.T. ; Neoh, K.G. ; Chan, L.; Lai, D.M.Y.; Huan, A.C.H.
5-Feb-2004Surface properties of miscible poly(1,1,1,3,3,3-hexafluoroisopropyl methacrylate)/phenoxy blendsHuang, H.L.; Goh, S.H. ; Lai, D.M.Y.; Huan, C.H.A. ; Wee, A.T.S. 
15-Apr-2004ToF-SIMS studies of poly(methyl methacrylate-co-methacrylic acid), poly(2,2,3,3,3-pentafluoropropyl methacrylate-co-4-vinylpyridine) and their blendsHuang, H.L.; Goh, S.H. ; Lai, D.M.Y.; Huan, C.H.A.