Browsing by Author Kripesh, V.

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Issue DateTitleAuthor(s)
2006A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packagingLiao, E.B.; Tay, A.A.O. ; Ang, S.S.T.; Feng, H.H.; Nagarajan, R.; Kripesh, V.; Kumar, R.; Iyer, M.K.
Aug-2007A novel test strategy for fine pitch wafer-level packaged devicesJayabalan, J.; Rotaru, M.D.; Rao, V.S.; Kripesh, V.; Iyer, M.K.; Tay, A.A.O. ; Ooi, B.-L. ; Leong, M.-S. 
1-Sep-2006A thick photoresist process for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresistRao, V.S.; Kripesh, V.; Yoon, S.W.; Tay, A.A.O. 
2004Bed of Nails - 100 microns pitch wafer level interconnections processRao, V.S.; Tay, A.A.O. ; Kripesh, V.; Lim, C.T. ; Yoon, S.W.
2008Bed of nails - 100-μm-pitch wafer-level interconnections processVempati, S.R.; Tay, A.A.O. ; Kripesh, V.; Yoon, S.W.
2005Bed of nails: Fine pitch wafer-level packaging interconnects for high performance nano devicesRao, V.S.; Kripesh, V.; Yoon, S.W.; Witarsa, D.; Tay, A.A.O. 
2005Compliance, deformation and thermal fatigue behavior of multi-copper-column interconnectsLiao, E.B.; Tay, A.A.O. ; Ang, S.S.T.; Feng, H.H.; Nagarajan, R.; Kripesh, V.; Kumar, R.; Mahadevan, I.
2010Determination of tensile properties of lead-free solder joints using nanoindentationChandra Rao, B.S.S.; Zeng, K.Y. ; Kripesh, V.
2011Diffusion kinetics and mechanical behavior of lead-free microbump solder joints in 3D packaging applicationsRao, B.S.S.C.; Kripesh, V.; Zeng, K.Y. 
2010Effect of solder volume on diffusion kinetics and mechanical properties of microbump solder jointsChandra Rao, B.S.S.; Fernandez, D.M.; Kripesh, V.; Zeng, K.Y. 
2009Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite soldersChandra Rao, B.S.S.; Mohan Kumar, K.; Zeng, K.Y. ; Tay, A.A.O. ; Kripesh, V.
2004Effects of wetting angle and loading direction on fatigue behavior of multi-copper column flip-chip interconnectsLiao, E.B.; Tay, A.A.O. ; Ang, S.S.T.; Feng, H.H.; Nagarajan, R.; Kripesh, V.
2004Fabrication and parametric study of wafer-level multiple-copper-column interconnectLiao, E.B.; Ang, S.S.; Tay, A.A.O. ; Feng, H.H.; Nagarajan, R.; Kripesh, V.
Sep-2006Fatigue and bridging study of high-aspect-ratio multicopper-column flip-chip interconnects through solder joint shape modelingLiao, E.B.; Tay, A.A.O. ; Ang, S.S.T.; Feng, H.H.; Nagarajan, R.; Kripesh, V.
Apr-2006Fractal analysis of intermetallic compounds in Sn-Ag, Sn-Ag-Bi, and Sn-Ag-Cu diffusion couplesJayaganthan, R. ; Mohankumar, K.; Sekhar, V.N.; Tay, A.A.O. ; Kripesh, V.
2004Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applicationsJayaganthan, R. ; Mohankumar, K.; Tay, A.A.O. ; Kripesh, V.
8-May-2008Influence of single-wall carbon nanotube addition on the microstructural and tensile properties of Sn-Pb solder alloyKumar, K.M.; Kripesh, V.; Tay, A.A.O. 
2007Modeling of dry self-assembly process for mass rapid assembling microchips on silicon substrateGao, X. ; Tay, A.A.O. ; Kripesh, V.
2004Nano-particle reinforced solders for fine pitch applicationsMohankumar, K.; Tay, A.A.O. ; Kripesh, V.
2004Nanoindentation study of the Pb-free solders in fine pitch interconnectsMohankumar, K.; Tay, A.A.O. ; Kripesh, V.