Browsing by Author Ho, S.L.

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Issue DateTitleAuthor(s)
20133D vs 2D modeling of the effect of die size on delamination in encapsulated IC packagesHo, S.L.; Tay, A.A.O. 
11-Apr-2002A comparative study of neural network and Box-Jenkins ARIMA modeling in time series predictionHo, S.L.; Xie, M. ; Goh, T.N. 
2011A numerical analysis of penny-shaped delaminations in an encapsulated silicon moduleHo, S.L.; Tay, A.A.O. 
2009A numerical study of 3D interfacial delamination in PQFP packagesHo, S.L.; Tay, A.A.O. 
Oct-2003A Study of the Connectionist Models for Software Reliability PredictionHo, S.L.; Xie, M. ; Goh, T.N. 
2006Adopting Six Sigma in higher education: Some issues and challengesHo, S.L.; Xie, M. ; Goh, T.N. 
1999Analysis of repairable system failure data using time series modelsXie, M. ; Ho, S.L.
2003Application of neural networks in forecasting engine systems reliabilityXu, K. ; Xie, M. ; Tang, L.C. ; Ho, S.L.
2009Association of LOXL1 polymorphisms with pseudoexfoliation in the ChineseLee, K.Y.C.; Aung, T. ; Ho, S.L.; Pek, D.C.K.; Thalamuthu, A.; Venkatraman, A.; Venkataraman, D.; Vithana, E.N. 
2012Cohesive zone modeling of 3D delamination in encapsulated silicon devicesHo, S.L.; Joshi, S.P. ; Tay, A.A.O. 
1998Development of train movement simulator for analysis and optimization of railway signalling systemsChang, C.S. ; Chua, C.S.; Quek, H.B.; Xu, X.Y.; Ho, S.L.
2009Effect of Shapes of Crack Fronts on the Mechanics of 3D Interfacial Delamination in IC PackagesHo, S.L.; Tay, A.A.O. 
2010Effect of the die edge and multiple delaniinations on the mechanics of delamination in a PQFPHo, S.L.; Yu, J.; Tay, A.A.O. 
2013Experiments and three-dimensional modeling of delamination in an encapsulated microelectronic package under thermal loadingHo, S.L.; Joshi, S.P. ; Tay, A.A.O. 
Jan-2002Fuzzy assessment of FMEA for engine systemsXu, K. ; Tang, L.C. ; Xie, M. ; Ho, S.L.; Zhu, M.L.
Jan-2002Fuzzy assessment of FMEA for engine systemsXu, K. ; Tang, L.C. ; Xie, M. ; Ho, S.L.; Zhu, M.L.
2014Heating rate dependent delamination of metal-polymer interfaces: Experiments and modelingHo, S.L.; Joshi, S.P. ; Tay, A.A.O. 
2010Interaction of multiple delaminations and die in a plastic IC packageHo, S.L.; Yu, J.; Tay, A.A.O. 
2010Interaction of multiple delaminations in a PQFPHo, S.L.; Yu, J.; Tay, A.A.O. 
2011Moisture diffusion modeling and its impact on fracture mechanics parameters with regard to a PQFPHo, S.L.; Tay, A.A.O.