Browsing by Author Li, W.H.

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Showing results 2 to 9 of 9 < previous 
Issue DateTitleAuthor(s)
Dec-2001Electrochemical deposition of copper on patterned Cu/Ta(N)/SiO2 surfaces for super filling of sub-micron featuresLi, W.H.; Ye, J.H.; Li, S.F.Y. 
20-Mar-2000In situ scanning tunneling microscopy investigation of restructuring and anodic dissolution of Cu( 111 ) electrode in sulphuric acid solutionLi, W.H.; Ye, J.H.; Li, S.F.Y. ; Nichols, R.J.
1-Sep-2013Mitigation methods of climate change impact on the cooling load of public residential buildings in singaporeWong, N.H. ; Jusuf, S.K. ; Syafii, N.I.; Li, W.H.; Tan, E. 
May-2005Numerical modeling of dielectrophoresis using a meshless approachChen, D.F.; Du, H.; Li, W.H.; Shu, C. 
20-Dec-2005Numerical solution of traveling wave dielectrophoresis using a meshless finite difference schemeDu, H.J.; Chen, D.F.; Li, W.H.; Shu, C. 
2006Reduction of leakage and low-frequency noise in MOS transistors through two-step RTA of NiSi-Silicide technologyYang, R.; Loh, W.Y.; Yu, M.B.; Xiong, Y-.Z.; Choy, S.F.; Jiang, Y.; Chan, D.S.H. ; Lim, Y.F.; Bera, L.K.; Wong, L.Y.; Li, W.H.; Du, A.Y.; Tung, C.H.; Hoe, K.M.; Lo, G.Q.; Balasubramanian, N.; Kwong, D.-L.
2012Simulation of the impact of climate change on the current building's residential envelope thermal transfer value (ETTV) regulation in SingaporeWong, N.H. ; Jusuf, S.K. ; Syafii, N.I.; Li, W.H.; Tan, A.Y.K.
2006Simulation of traveling wave dielectrophoresis using a meshless methodChen, D.F.; Du, H.; Li, W.H.; Shu, C.