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Browsing by Author Cheng, Li

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Issue DateTitleAuthor(s)
Oct-2008C*-controlled creep crack growth by grain boundary cavitationTang, S. ; Guo, T.F. ; Cheng, L. 
Nov-2008Creep fracture toughness using conventional and cell element approachesTang, S. ; Guo, T.F. ; Cheng, L. 
2000Dynamic ductile crack growth and transition to cleavage - A cell model approachXia, L.; Cheng, L. 
Feb-2009Dynamic toughness in elastic nonlinear viscous solidsTang, S. ; Guo, T.F. ; Cheng, L. 
20-Sep-2001Effect of limited matrix-reinforcement interfacial reaction on enhancing the mechanical properties of aluminium-silicon carbide compositesTham, L.M.; Gupta, M. ; Cheng, L. 
31-Mar-2002Effect of reinforcement volume fraction on the evolution of reinforcement size during the extrusion of Al-SiC compositesTham, L.M.; Gupta, M. ; Cheng, L. 
Oct-2006Effects of pressure-sensitivity and plastic dilatancy on void growth and interactionChew, H.B.; Guo, T.F. ; Cheng, L. 
2005Electronic speckle pattern interferometry of residual stress measurement using hole-indentation methodSim, C.N.; Tay, C.J. ; Cheng, L. 
1-Aug-2010Humidity-driven bifurcation in a hydrogel-actuated nanostructure: A three-dimensional computational analysisWong, W.H.; Guo, T.F.; Zhang, Y.W. ; Cheng, L. 
1-Aug-2010Humidity-driven bifurcation in a hydrogel-actuated nanostructure: A three-dimensional computational analysisWong, W.H.; Guo, T.F.; Zhang, Y.W. ; Cheng, L. 
2005Influence of non-uniform initial porosity distribution on adhesive failure in electronic packagesChew, H.B.; Guo, T.F. ; Cheng, L. 
2008Influence of nonuniform initial porosity distribution on adhesive failure in electronic packagesChew, H.B.; Guo, T.F. ; Cheng, L. 
Oct-1999Influence of processing parameters during disintegrated melt deposition processing on near net shape synthesis of aluminium based metal matrix compositesTham, L.M.; Gupta, M. ; Cheng, L. 
19-May-1999Influence of processing parameters on the near-net shape synthesis of aluminium-based metal matrix compositesTham, L.M.; Gupta, M. ; Cheng, L. 
2007Influence of vapor pressure on rate-dependent void growth in IC packagesWong, W.H.; Guo, T.F. ; Cheng, L. 
2007Influence of vapor pressure on rate-dependent void growth in IC packagesWong, W.H.; Guo, T.F. ; Cheng, L. 
Feb-2003Interface delamination in plastic IC packages induced by thermal loading and vapor pressure - A micromechanics modelLiu, P.; Cheng, L. ; Zhang, Y.-W. 
16-Mar-2001Interface toughness under combined mode I, II and III loadingsLiu, P.; Cheng, L. ; Zhang, Y.W.
14-Mar-2001Measuring interface parameters and toughness - A computational studyLiu, P.; Cheng, L. ; Zhang, Y.W.
2009Metallic nanoparticles and nanostructures for bio-applicationsZhang, J.B.; Cheng, L. ; Yung, L.Y.L. ; Chua, S.S.; Sze, J.Y.; Zhu, S.L.; Ayi, T.C.; Jeevaneswaran, R.
Showing results 1 to 20 of 58  next >