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Cheng, Li
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Showing results 1 to 20 of 58
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Issue Date
Title
Author(s)
Oct-2008
C*-controlled creep crack growth by grain boundary cavitation
Tang, S.
;
Guo, T.F.
;
Cheng, L.
Nov-2008
Creep fracture toughness using conventional and cell element approaches
Tang, S.
;
Guo, T.F.
;
Cheng, L.
2000
Dynamic ductile crack growth and transition to cleavage - A cell model approach
Xia, L.
;
Cheng, L.
Feb-2009
Dynamic toughness in elastic nonlinear viscous solids
Tang, S.
;
Guo, T.F.
;
Cheng, L.
20-Sep-2001
Effect of limited matrix-reinforcement interfacial reaction on enhancing the mechanical properties of aluminium-silicon carbide composites
Tham, L.M.
;
Gupta, M.
;
Cheng, L.
31-Mar-2002
Effect of reinforcement volume fraction on the evolution of reinforcement size during the extrusion of Al-SiC composites
Tham, L.M.
;
Gupta, M.
;
Cheng, L.
Oct-2006
Effects of pressure-sensitivity and plastic dilatancy on void growth and interaction
Chew, H.B.
;
Guo, T.F.
;
Cheng, L.
2005
Electronic speckle pattern interferometry of residual stress measurement using hole-indentation method
Sim, C.N.
;
Tay, C.J.
;
Cheng, L.
1-Aug-2010
Humidity-driven bifurcation in a hydrogel-actuated nanostructure: A three-dimensional computational analysis
Wong, W.H.
;
Guo, T.F.
;
Zhang, Y.W.
;
Cheng, L.
1-Aug-2010
Humidity-driven bifurcation in a hydrogel-actuated nanostructure: A three-dimensional computational analysis
Wong, W.H.
;
Guo, T.F.
;
Zhang, Y.W.
;
Cheng, L.
2005
Influence of non-uniform initial porosity distribution on adhesive failure in electronic packages
Chew, H.B.
;
Guo, T.F.
;
Cheng, L.
2008
Influence of nonuniform initial porosity distribution on adhesive failure in electronic packages
Chew, H.B.
;
Guo, T.F.
;
Cheng, L.
Oct-1999
Influence of processing parameters during disintegrated melt deposition processing on near net shape synthesis of aluminium based metal matrix composites
Tham, L.M.
;
Gupta, M.
;
Cheng, L.
19-May-1999
Influence of processing parameters on the near-net shape synthesis of aluminium-based metal matrix composites
Tham, L.M.
;
Gupta, M.
;
Cheng, L.
2007
Influence of vapor pressure on rate-dependent void growth in IC packages
Wong, W.H.
;
Guo, T.F.
;
Cheng, L.
2007
Influence of vapor pressure on rate-dependent void growth in IC packages
Wong, W.H.
;
Guo, T.F.
;
Cheng, L.
Feb-2003
Interface delamination in plastic IC packages induced by thermal loading and vapor pressure - A micromechanics model
Liu, P.
;
Cheng, L.
;
Zhang, Y.-W.
16-Mar-2001
Interface toughness under combined mode I, II and III loadings
Liu, P.
;
Cheng, L.
;
Zhang, Y.W.
14-Mar-2001
Measuring interface parameters and toughness - A computational study
Liu, P.
;
Cheng, L.
;
Zhang, Y.W.
2009
Metallic nanoparticles and nanostructures for bio-applications
Zhang, J.B.
;
Cheng, L.
;
Yung, L.Y.L.
;
Chua, S.S.
;
Sze, J.Y.
;
Zhu, S.L.
;
Ayi, T.C.
;
Jeevaneswaran, R.