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Issue Date	Title	Author(s)
1993	Measurement and evaluation of polyaniline degradation	Cui, C.Q. ; Su, X.H.; Lee, J.Y.
10-May-1993	Measurement of the extent of impurity incorporation during potentiostatic and cyclic potential sweep depositions of polyaniline	Cui, C.Q. ; Ong, L.H. ; Tan, T.C. ; Lee, J.Y.
10-May-1993	Measurement of the extent of impurity incorporation during potentiostatic and cyclic potential sweep depositions of polyaniline	Cui, C.Q. ; Ong, L.H. ; Tan, T.C. ; Lee, J.Y.
12-Sep-1996	Metal-polymer interactions in the Ag+\|poly-o-aminophenol system	Zhang, A.Q.; Cui, C.Q. ; Lee, J.Y.
1-Apr-2003	Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate	ZHANG, JUNFENG ; CUI, CHENG QIANG ; LIM, THIAM BENG ; KANG, EN-TANG
1-Jan-2002	Method for low temperature lamination of metals to fluoropolymers	KANG, EN TANG ; SHI, JIAN-LI ; NEOH, KOON GEE ; TAN, KUANG LEE ; CUI, CHENG QIANG ; LIM, THIAM BENG
25-Mar-2003	Method for low temperature lamination of metals to polyimides	KANG, EN-TANG ; ANG, ARTHUR KHOON SIAH; NEOH, KOON GEE ; CUI, CHENG QIANG ; LIM, THIAM BENG
Nov-1996	Modification of substrate surface for BGA overmold adhesion enhancement by graft copolymerization	Wang, T.; Kang, E.T. ; Neoh, K.G. ; Tan, K.L. ; Cui, C.Q. ; Chakravorty, K.K.; Lim, T.B.
30-Nov-1993	Modified polyaniline through simultaneous electrochemical polymerization of aniline and metanilic acid	Lee, J.Y. ; Cui, C.Q. ; Su, X.H.; Zhou, M.S.
Aug-1995	Nickel deposition from unbuffered neutral chloride solutions in the presence of oxygen	Cui, C.Q. ; Lee, J.Y.
1997	Numerical simulation of the flip-chip underfilling process	Tay, A.A.O. ; Huang, Z.M. ; Wu, J.H. ; Cui, C.Q.
10-Mar-1993	Origin of the difference between potentiostatic and cyclic potential sweep depositions of polyaniline	Cui, C.Q. ; Ong, L.H. ; Tan, T.C. ; Lee, J.Y.
10-Mar-1993	Origin of the difference between potentiostatic and cyclic potential sweep depositions of polyaniline	Cui, C.Q. ; Ong, L.H. ; Tan, T.C. ; Lee, J.Y.
Oct-2001	Plasma polymerization and deposition of glycidyl methacrylate on Si(100) surface for adhesion improvement with polyimide	Zou, X.P.; Kang, E.T. ; Neoh, K.G.; Zhang, Y. ; Tan, K.L. ; Cui, C.Q. ; Lim, T.B.
Jan-1993	Reactive deposition of ultrafine cobalt powders - Part I Electrochemical investigation	Cui, C.Q. ; Tseung, A.C.C.
Jan-1994	Reactive deposition of ultrafine cobalt powders - Part II Effect of preparation conditions	Cui, C.Q. ; Lee, J.Y. ; Tan, T.C.
1999	Surface graft copolymerization enhanced adhesion of an epoxy-based printed circuit board substrate (FR-4) to copper	Liu, Y.X.; Kang, E.T. ; Neoh, K.G. ; Zhang, J.F.; Cui, C.Q. ; Lim, T.B.
1999	Surface graft copolymerization of poly(tetrafluoroethylene) film with simultaneous lamination to copper foil	Kang, E.T. ; Liu, Y.X.; Neoh, K.G. ; Tan, K.L. ; Cui, C.Q. ; Lim, T.B.
Dec-2001	Surface modification of poly(tetrafluoroethylene) films by plasma pre-activation and plasma polymerization of glycidyl methacrylate	Zou, X.P.; Kang, E.T. ; Neoh, K.G. ; Cui, C.Q. ; Lim, T.B.
1997	Surface structures and adhesion enhancement of poly(tetrafluoroethylene) films after modification by graft copolymerization with glycidyl methacrylate	Wang, T.; Kang, E.T. ; Neoh, K.G. ; Tan, K.L. ; Cui, C.Q. ; Lim, T.B.

Showing results 14 to 33 of 34 < previous next >