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Browsing by Author Cui Cheng Qiang

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Issue DateTitleAuthor(s)
4-Mar-1994Effect of polyaniline on oxygen reduction in buffered neutral solutionCui, C.Q. ; Lee, J.Y. 
Aug-1994Effects of oxygen reduction on nickel deposition from unbuffered aqueous solutions. I. Deposition process and deposit structureCui, C.Q. ; Lee, Jim Y. 
21-Feb-1996Electrochemical copolymerization of aniline and metanilic acidLee, J.Y. ; Cui, C.Q. 
Jun-1995Electrochemical degradation of polyaniline in HClO4 and H2SO4Zhang, A.Q.; Cui, C.Q. ; Lee, J.Y. 
Jul-1993Extent of incorporation of hydrolysis products in polyaniline films deposited by cyclic potential sweepCui, C.Q. ; Ong, L.H. ; Tan, T.C. ; Lee, J.Y. 
2000Grafting of epoxy resin on surface-modified poly(tetrafluoroethylene) filmsYu, Z.J.; Kang, E.T. ; Neoh, K.G. ; Cui, C.Q. ; Lim, T.B.
2000Grafting of epoxy resin on surface-modified poly(tetrafluoroethylene) filmsYu, Z.J.; Kang, E.T. ; Neoh, K.G. ; Cui, C.Q. ; Lim, T.B.
Jan-2000Low-temperature graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foils - Effect of crosslinking agentsAng, A.K.S.; Kang, E.T. ; Neoh, K.G. ; Tan, K.L. ; Cui, C.Q. ; Lim, T.B. 
1998Low-temperature thermal graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foilsAng, A.K.S.; Kang, E.T. ; Neoh, K.G. ; Tan, K.L. ; Cui, C.Q. ; Lim, T.B. 
1993Measurement and evaluation of polyaniline degradationCui, C.Q. ; Su, X.H.; Lee, J.Y. 
10-May-1993Measurement of the extent of impurity incorporation during potentiostatic and cyclic potential sweep depositions of polyanilineCui, C.Q. ; Ong, L.H. ; Tan, T.C. ; Lee, J.Y. 
10-May-1993Measurement of the extent of impurity incorporation during potentiostatic and cyclic potential sweep depositions of polyanilineCui, C.Q. ; Ong, L.H. ; Tan, T.C. ; Lee, J.Y. 
12-Sep-1996Metal-polymer interactions in the Ag+|poly-o-aminophenol systemZhang, A.Q.; Cui, C.Q. ; Lee, J.Y. 
1-Apr-2003Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrateZHANG, JUNFENG ; CUI, CHENG QIANG ; LIM, THIAM BENG ; KANG, EN-TANG 
1-Jan-2002Method for low temperature lamination of metals to fluoropolymersKANG, EN TANG ; SHI, JIAN-LI ; NEOH, KOON GEE ; TAN, KUANG LEE ; CUI, CHENG QIANG ; LIM, THIAM BENG 
25-Mar-2003Method for low temperature lamination of metals to polyimidesKANG, EN-TANG ; ANG, ARTHUR KHOON SIAH; NEOH, KOON GEE ; CUI, CHENG QIANG ; LIM, THIAM BENG 
Nov-1996Modification of substrate surface for BGA overmold adhesion enhancement by graft copolymerizationWang, T.; Kang, E.T. ; Neoh, K.G. ; Tan, K.L. ; Cui, C.Q. ; Chakravorty, K.K.; Lim, T.B. 
30-Nov-1993Modified polyaniline through simultaneous electrochemical polymerization of aniline and metanilic acidLee, J.Y. ; Cui, C.Q. ; Su, X.H.; Zhou, M.S. 
Aug-1995Nickel deposition from unbuffered neutral chloride solutions in the presence of oxygenCui, C.Q. ; Lee, J.Y. 
1997Numerical simulation of the flip-chip underfilling processTay, A.A.O. ; Huang, Z.M. ; Wu, J.H. ; Cui, C.Q. 
Showing results 5 to 24 of 34 < previous   next >