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Cui Cheng Qiang
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Showing results 5 to 24 of 34
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Issue Date
Title
Author(s)
4-Mar-1994
Effect of polyaniline on oxygen reduction in buffered neutral solution
Cui, C.Q.
;
Lee, J.Y.
Aug-1994
Effects of oxygen reduction on nickel deposition from unbuffered aqueous solutions. I. Deposition process and deposit structure
Cui, C.Q.
;
Lee, Jim Y.
21-Feb-1996
Electrochemical copolymerization of aniline and metanilic acid
Lee, J.Y.
;
Cui, C.Q.
Jun-1995
Electrochemical degradation of polyaniline in HClO4 and H2SO4
Zhang, A.Q.
;
Cui, C.Q.
;
Lee, J.Y.
Jul-1993
Extent of incorporation of hydrolysis products in polyaniline films deposited by cyclic potential sweep
Cui, C.Q.
;
Ong, L.H.
;
Tan, T.C.
;
Lee, J.Y.
2000
Grafting of epoxy resin on surface-modified poly(tetrafluoroethylene) films
Yu, Z.J.
;
Kang, E.T.
;
Neoh, K.G.
;
Cui, C.Q.
;
Lim, T.B.
2000
Grafting of epoxy resin on surface-modified poly(tetrafluoroethylene) films
Yu, Z.J.
;
Kang, E.T.
;
Neoh, K.G.
;
Cui, C.Q.
;
Lim, T.B.
Jan-2000
Low-temperature graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foils - Effect of crosslinking agents
Ang, A.K.S.
;
Kang, E.T.
;
Neoh, K.G.
;
Tan, K.L.
;
Cui, C.Q.
;
Lim, T.B.
1998
Low-temperature thermal graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foils
Ang, A.K.S.
;
Kang, E.T.
;
Neoh, K.G.
;
Tan, K.L.
;
Cui, C.Q.
;
Lim, T.B.
1993
Measurement and evaluation of polyaniline degradation
Cui, C.Q.
;
Su, X.H.
;
Lee, J.Y.
10-May-1993
Measurement of the extent of impurity incorporation during potentiostatic and cyclic potential sweep depositions of polyaniline
Cui, C.Q.
;
Ong, L.H.
;
Tan, T.C.
;
Lee, J.Y.
10-May-1993
Measurement of the extent of impurity incorporation during potentiostatic and cyclic potential sweep depositions of polyaniline
Cui, C.Q.
;
Ong, L.H.
;
Tan, T.C.
;
Lee, J.Y.
12-Sep-1996
Metal-polymer interactions in the Ag+|poly-o-aminophenol system
Zhang, A.Q.
;
Cui, C.Q.
;
Lee, J.Y.
1-Apr-2003
Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate
ZHANG, JUNFENG
;
CUI, CHENG QIANG
;
LIM, THIAM BENG
;
KANG, EN-TANG
1-Jan-2002
Method for low temperature lamination of metals to fluoropolymers
KANG, EN TANG
;
SHI, JIAN-LI
;
NEOH, KOON GEE
;
TAN, KUANG LEE
;
CUI, CHENG QIANG
;
LIM, THIAM BENG
25-Mar-2003
Method for low temperature lamination of metals to polyimides
KANG, EN-TANG
;
ANG, ARTHUR KHOON SIAH
;
NEOH, KOON GEE
;
CUI, CHENG QIANG
;
LIM, THIAM BENG
Nov-1996
Modification of substrate surface for BGA overmold adhesion enhancement by graft copolymerization
Wang, T.
;
Kang, E.T.
;
Neoh, K.G.
;
Tan, K.L.
;
Cui, C.Q.
;
Chakravorty, K.K.
;
Lim, T.B.
30-Nov-1993
Modified polyaniline through simultaneous electrochemical polymerization of aniline and metanilic acid
Lee, J.Y.
;
Cui, C.Q.
;
Su, X.H.
;
Zhou, M.S.
Aug-1995
Nickel deposition from unbuffered neutral chloride solutions in the presence of oxygen
Cui, C.Q.
;
Lee, J.Y.
1997
Numerical simulation of the flip-chip underfilling process
Tay, A.A.O.
;
Huang, Z.M.
;
Wu, J.H.
;
Cui, C.Q.