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LIU KUI
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Showing results 13 to 15 of 15
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Issue Date
Title
Author(s)
2004
Study of ductile mode cutting in grooving of tungsten carbide with and without ultrasonic vibration assistance
Liu, K.
;
Li, X.P.
;
Rahman, M.
;
Liu, X.D.
2007
The effect of the cutting edge radius on a machined surface in the nanoscale ductile mode cutting of silicon wafer
Arefin, S.
;
Li, X.P.
;
Cai, M.B.
;
Rahman, M.
;
Liu, K.
;
Tay, A.
Jan-2007
The upper bound of tool edge radius for nanoscale ductile mode cutting of silicon wafer
Arefin, S.
;
Li, X.P.
;
Rahman, M.
;
Liu, K.