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	Issue Date	Title	Author(s)
	15-Jun-2001	Ductile cutting of tungsten carbide	Liu, K. ; Li, X.P
	2002	Effect of cutting edge radius on ductile-brittle transition in cutting of silicon-wafers	Li, X.P. ; Chan, C.C.; Liu, K. ; Rahman, M. ; Liu, X.D.
	22-Sep-2003	Nano-precision measurement of diamond tool edge radius for wafer fabrication	Li, X.P. ; Rahman, M. ; Liu, K. ; Neo, K.S. ; Chan, C.C.
	2003	Nanometer scale ductile cutting of tungsten carbide	Liu, K. ; Li, X. ; Liang, S.Y.
	2004	Nanometer scale ductile mode cutting of soda-lime glass	Liu, K. ; Li, X. ; Liang, S.Y.; Liu, X.D.
	2004	Nanometer-scale ductile cutting of tungsten carbide	Liu, K. ; Li, X. ; Liang, S.Y.
	2005	Nanometer-scale, ductile-mode cutting of soda-lime glass	Liu, K. ; Li, X. ; Liang, S.Y.; Liu, X.D.
	2009	Numerical and experimental analysis of the tool edge radius effect in micromachining of ferrous materials	Woon, K.-S.; Rahman, M. ; Liu, K.
	30-Apr-2007	Performance of single crystal diamond tools in ductile mode cutting of silicon	Uddin, M.S.; Seah, K.H.W. ; Rahman, M. ; Li, X.P. ; Liu, K.
	2004	Study of ductile mode cutting in grooving of tungsten carbide with and without ultrasonic vibration assistance	Liu, K. ; Li, X.P. ; Rahman, M. ; Liu, X.D.
	2007	The effect of the cutting edge radius on a machined surface in the nanoscale ductile mode cutting of silicon wafer	Arefin, S.; Li, X.P. ; Cai, M.B.; Rahman, M. ; Liu, K. ; Tay, A.
	Jan-2007	The upper bound of tool edge radius for nanoscale ductile mode cutting of silicon wafer	Arefin, S.; Li, X.P. ; Rahman, M. ; Liu, K.

Showing results 4 to 15 of 15 < previous