Browsing by Author LEE CHENGKUO

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Showing results 168 to 187 of 187 < previous 
Issue DateTitleAuthor(s)
2013Tantalum-nitride antifuse electromechanical OTP for embedded memory applicationsSingh, P.; Li, C.G.; Pitchappa, P.; Lee, C. 
15-Jul-2009The comparison between the graded photonic crystal coupler and various couplersChien, H.-T.; Lee, C. ; Chiu, H.-K.; Hsu, K.-C.; Chen, C.-C.; Ho, J.-A.A.; Chou, C.
Apr-2012The effects of interlayer mismatch on electronic properties of bilayer armchair graphene nanoribbonsQian, Y.; Lam, K.-T.; Lee, C. ; Liang, G. 
2009The role of Ni buffer layer on high yield low temperature hermetic wafer bonding using In/Sn/Cu metallizationYu, D.-Q.; Lee, C. ; Yan, L.L.; Choi, W.K.; Yu, A.; Lau, J.H.
2008The role ofni buffer layer between insn solder and eu metallization for hermetic wafer bondingYu, D.; Lee, C. ; Lau, J.H.
Nov-2009Theoretical comparison of the energy harvesting capability among various electrostatic mechanisms from structure aspectLee, C. ; Lim, Y.M.; Yang, B.; Kotlanka, R.K.; Heng, C.-H. ; He, J.H.; Tang, M.; Xie, J.; Feng, H.
2008Theoretical study of the output energy for various MEMS based electrostatic mechanismsLim, Y.M.; Yang, B.; Kotlanka, R.K.; Heng, C.H. ; Xie, J.; Tang, M.; Han, J.H.; Feng, H.; Lee, C. 
2013Thermally tunable photonic dual-disk resonator with wide operation rangeLi, B.; Ho, C.P.; Lee, C. 
2013Three-dimensional movable metamaterial using electric split-ring resonatorsLin, Y.-S.; Ma, F.; Lee, C. 
2010Torsional mirror driven by a cantilever beam integrated with 1x10 individually biased PZT array actuator for VOA applicationKoh, K.H.; Kobayashi, T.; Lee, C. 
2013Transparent force sensing arrays with low power consumption using liquid crystal arraysHuang, C.-Y.; Lou, L.; Danner, A.J. ; Lee, C. 
2013Tunable THz filter using 3-D split-ring resonatorsLin, Y.-S.; Ho, C.P.; Pitchappa, P.; Ma, F.; Qian, Y.; Kropelnicki, P.; Lee, C. 
2013Ultra-broadband electromagnetic MEMS vibration energy harvestingLiu, H.; Dhakar, L.; Lee, C. 
2014Ultra-wide frequency broadening mechanism for micro-scale electromagnetic energy harvesterLiu, H.; How Koh, K.; Lee, C. 
2010Ultrasensitive nanowire pressure sensor makes its debutSoon, B.W.; Neuzil, P.; Wong, C.C.; Reboud, J.; Feng, H.H.; Lee, C. 
2012Vacuum based wafer level encapsulation (WLE) of MEMS using physical vapor deposition (PVD)Soon, B.W.; Singh, N.; Tsai, J.M.; Lee, C. 
Jan-2007Variable optical attenuator using planar light attenuation scheme based on rotational and translational misalignmentLee, C. 
2008Wafer level hermetic bonding using Sn/In and Cu/Ti/Au metallizationYu, D.; Yan, L.; Lee, C. ; Choi, W.K.; Thew, M.L.; Foo, C.K.; Lau, J.H.
Dec-2009Wafer-level hermetic bonding using Sn/In and Cu/Ti/Au metallizationYu, D.-Q.; Yan, L.L.; Lee, C. ; Choi, W.K.; Thew, S.; Foo, C.K.; Lau, J.H.
2010Wafer-level vacuum sealing and encapsulation for fabrication of CMOS MEMS thermoelectric power generatorsXie, J.; Lee, C. ; Wang, M.-F.; Feng, H.