Browsing by Author TAY AH ONG,ANDREW

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Issue DateTitleAuthor(s)
20133D vs 2D modeling of the effect of die size on delamination in encapsulated IC packagesHo, S.L.; Tay, A.A.O. 
Apr-2010A chip scale nanofluidic pump using electrically controllable hydrophobicityLiu, H.; Dharmatilleke, S.; Tay, A.A.O. 
2014A dual-character InGaN/GaN multiple quantum well device for electroluminescence and photovoltaic absorption of near-mutually exclusive wavelengthsHo, J.-W.; Dolmanan, S.-B.; Tay, C.B. ; Wee, Q.; Tay, A.A.O. ; Chua, S.-J. 
2006A hybrid equivalent-layer model for analysis of solder joint reliability of ultra-fine pitch packagesZhao, B.; Tay, A.A.O. ; Prakash, T. 
2009A hydrophobicity controlled nanofluidic pumpLiu, H.; Dharmatilleke, S.; Tay, A.A.O. 
1997A J-integral criterion for delamination of bi-material interfaces incorporating hygrothermal stressLin, T.Y.; Tay, A.A.O. 
2004A low cost polymer based piezo-actuated micropump for drug delivery systemLiu, H. ; Tay, A.A.O. ; Wan, S.Y.M.; Lim, G.C.
2006A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packagingLiao, E.B.; Tay, A.A.O. ; Ang, S.S.T.; Feng, H.H.; Nagarajan, R.; Kripesh, V.; Kumar, R.; Iyer, M.K.
2003A modified button-shear method for measuring fracture toughness of polymer-metal interfaces in IC packagesTay, A.A.O. ; Phang, J.S. ; Wong, E.H.; Ranjan, R.
Mar-2014A new accurate closed-form analytical solution for junction temperature of high-powered devicesLing, J.H.L.; Tay, A.A.O. 
2005A new modified crack surface displacement extrapolation method for analysis of package delaminationGuojun, H.; Tay, A.A.O. 
Jan-2005A new variable-order singular boundary element for calculating stress intensity factors in three-dimensional elasticity problemsZhou, W.; Lim, K.M. ; Lee, K.H. ; Tay, A.A.O. 
30-Sep-2002A new variable-order singular boundary element for two-dimensional stress analysisLim, K.M. ; Lee, K.H. ; Tay, A.A.O. ; Zhou, W.
Aug-2007A novel test strategy for fine pitch wafer-level packaged devicesJayabalan, J.; Rotaru, M.D.; Rao, V.S.; Kripesh, V.; Iyer, M.K.; Tay, A.A.O. ; Ooi, B.-L. ; Leong, M.-S. 
2011A numerical analysis of penny-shaped delaminations in an encapsulated silicon moduleHo, S.L.; Tay, A.A.O. 
2004A numerical and experimental study of delamination of polymer-metal interfaces in plastic packages at solder reflow temperaturesTay, A.A.O. ; Ma, Y. ; Nakamura, T.; Ong, S.H.
1988A numerical method for determining tensile stress-strain properties of plastics from total elongation measurementsTay, A.O. ; Teoh, S.H. 
2009A numerical study of 3D interfacial delamination in PQFP packagesHo, S.L.; Tay, A.A.O. 
2004A numerical study of fatigue life of copper column interconnections in wafer level packagesSun, W.; Tay, A.A.O. ; Vedantam, S. 
2002A numerical study of the effect of die, die pad and die attach thicknesses on thin plastic packagesTay, A.A.O. ; Zhu, H.