Browsing by Author Lim, Thiam Beng

Showing results 1 to 15 of 15
Issue DateTitleAuthor(s)
1993Criterion for predicting delamination in plastic IC packagesTay, A.A.O. ; Tan, G.L. ; Lim, T.B. 
30-Jun-1998IC packaging lead frame for reducing chip stress and deformationLIM, THIAM BENG ; BHANDARKAR, SARVOTHAM M. 
Jan-2000Low-temperature graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foils - Effect of crosslinking agentsAng, A.K.S.; Kang, E.T. ; Neoh, K.G. ; Tan, K.L. ; Cui, C.Q. ; Lim, T.B. 
1998Low-temperature thermal graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foilsAng, A.K.S.; Kang, E.T. ; Neoh, K.G. ; Tan, K.L. ; Cui, C.Q. ; Lim, T.B. 
1-Apr-2003Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrateZHANG, JUNFENG ; CUI, CHENG QIANG ; LIM, THIAM BENG ; KANG, EN-TANG 
1-Jan-2002Method for low temperature lamination of metals to fluoropolymersKANG, EN TANG ; SHI, JIAN-LI ; NEOH, KOON GEE ; TAN, KUANG LEE ; CUI, CHENG QIANG ; LIM, THIAM BENG 
25-Mar-2003Method for low temperature lamination of metals to polyimidesKANG, EN-TANG ; ANG, ARTHUR KHOON SIAH; NEOH, KOON GEE ; CUI, CHENG QIANG ; LIM, THIAM BENG 
Nov-1996Modification of substrate surface for BGA overmold adhesion enhancement by graft copolymerizationWang, T.; Kang, E.T. ; Neoh, K.G. ; Tan, K.L. ; Cui, C.Q. ; Chakravorty, K.K.; Lim, T.B. 
May-1994Predicting delamination in plastic IC packages and determining suitable mold compound propertiesTay, A.A.O. ; Tan, G.L. ; Lim, T.B. 
1999Surface graft copolymerization enhanced adhesion of an epoxy-based printed circuit board substrate (FR-4) to copperLiu, Y.X.; Kang, E.T. ; Neoh, K.G. ; Zhang, J.F.; Cui, C.Q. ; Lim, T.B. 
1999Surface graft copolymerization of poly(tetrafluoroethylene) film with simultaneous lamination to copper foilKang, E.T. ; Liu, Y.X.; Neoh, K.G. ; Tan, K.L. ; Cui, C.Q. ; Lim, T.B. 
Dec-2001Surface modification of poly(tetrafluoroethylene) films by plasma pre-activation and plasma polymerization of glycidyl methacrylateZou, X.P.; Kang, E.T. ; Neoh, K.G. ; Cui, C.Q. ; Lim, T.B. 
1997Surface structures and adhesion enhancement of poly(tetrafluoroethylene) films after modification by graft copolymerization with glycidyl methacrylateWang, T.; Kang, E.T. ; Neoh, K.G. ; Tan, K.L. ; Cui, C.Q. ; Lim, T.B. 
Mar-1995Wirebond deformation during molding of IC packagesTay, A.A.O. ; Yeo, K.S. ; Wu, J.H. ; Lim, T.B. 
1993Wirebound deformation during molding of IC packagesTay, A.A.O. ; Yeo, K.S. ; Wu, J.H. ; Lim, T.B.