Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.mee.2012.05.003
Title: Resist evaluation for Ni mold fabrication and proton beam writing
Authors: Wang, Y.H.
Malar, P. 
Zhao, J.
Van Kan, J.A. 
Keywords: AR-P 3250
Electroplating
ma-N 2410
PMMA
Proton beam writing (PBW)
Issue Date: Feb-2013
Citation: Wang, Y.H., Malar, P., Zhao, J., Van Kan, J.A. (2013-02). Resist evaluation for Ni mold fabrication and proton beam writing. Microelectronic Engineering 102 : 40-43. ScholarBank@NUS Repository. https://doi.org/10.1016/j.mee.2012.05.003
Abstract: In our experiments, we use different photoresists for proton beam writing and mold fabrication. We have fabricated Ni mold with structures down to 500 nm. We first use a fine focused proton beam to expose different photoresists, Polymethyl Methacrylate (PMMA), AR-P 3250 and ma-N 2410. After development and nickel sulfamate electroplating, the structures were faithfully transferred from the photoresists to Ni molds. © 2011 Elsevier B.V. All rights reserved.
Source Title: Microelectronic Engineering
URI: http://scholarbank.nus.edu.sg/handle/10635/98868
ISSN: 01679317
DOI: 10.1016/j.mee.2012.05.003
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