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|Title:||Fabrication of silicon microstructures using a high energy ion beam|
|Authors:||Teo, E.J. |
Proton beam writing
|Citation:||Teo, E.J., Liu, M.H., Breese, M.B.H., Tavernier, E.P., Bettiol, A.A., Blackwood, D.J., Watt, F. (2004). Fabrication of silicon microstructures using a high energy ion beam. Proceedings of SPIE - The International Society for Optical Engineering 5347 : 264-270. ScholarBank@NUS Repository. https://doi.org/10.1117/12.524314|
|Abstract:||We report an alternative technique which utilizes fast proton or helium ion irradiation prior to electrochemical etching for three-dimensional micro-fabrication in bulk p-type silicon. The ion-induced damage increases the resistivity of the irradiated regions and slows down porous silicon formation. A raised structure of the scanned area is left behind after removal of the un-irradiated regions with potassium hydroxide. The thickness of the removed material depends on the irradiated dose at each region so that multiple level structures can be produced with a single irradiation step. By exposing the silicon to different ion energies, the implanted depth and hence structure height can be precisely varied. We demonstrate the versatility of this three-dimensional patterning process to create multilevel cross structure and free-standing bridges in bulk silicon, as well as sub-micron pillars and high aspect-ratio nano-tips.|
|Source Title:||Proceedings of SPIE - The International Society for Optical Engineering|
|Appears in Collections:||Staff Publications|
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