Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/97196
Title: Micromachining using focused high energy ion beams: Deep Ion Beam Lithography
Authors: Van Kan, J.A. 
Sanchez, J.L.
Xu, B.
Osipowicz, T. 
Watt, F. 
Keywords: High aspect ratio
Micromachining
Nuclear microscope
Issue Date: 1999
Citation: Van Kan, J.A.,Sanchez, J.L.,Xu, B.,Osipowicz, T.,Watt, F. (1999). Micromachining using focused high energy ion beams: Deep Ion Beam Lithography. Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms 148 (1-4) : 1085-1089. ScholarBank@NUS Repository.
Abstract: The combination of deep X-ray lithography with electroforming and micromoulding (i.e., LIGA) has been shown to offer high potential for the production of high aspect-ratio microstructures. The LIGA technique, employing synchrotron light and a suitable X-ray mask, allows production of 3D microstructures in PMMA with aspect ratios around 100. Here we demonstrate that the novel technique of Deep Ion Beam Lithography (DIBL), a direct process utilizing a focused beam of MeV ions scanned in a predetermined pattern over a suitable resist material, can produce three dimensional micro structures with sub-micrometer feature sizes. Microstructures extending up to 100 μm from the substrate with aspect ratios approaching 100 can be produced. Multiple exposures at different ion energies allow production of multilayer structures in single resist layers of SU-8, a newly developed, chemically accelerated, negative tone, near UV, photoresist. © 1999 Elsevier Science B.V. All rights reserved.
Source Title: Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms
URI: http://scholarbank.nus.edu.sg/handle/10635/97196
ISSN: 0168583X
Appears in Collections:Staff Publications

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