Please use this identifier to cite or link to this item: https://doi.org/10.1002/(SICI)1096-9918(199908)28:13.0.CO;2-M
Title: Characterization of a low-k organic spin-on-glass as an intermetal dielectric
Authors: Wang, C.Y.
Zheng, J.Z.
Shen, Z.X. 
Xu, Y.
Lim, S.L.
Liu, R. 
Huan, A.C.H. 
Issue Date: 1999
Citation: Wang, C.Y.,Zheng, J.Z.,Shen, Z.X.,Xu, Y.,Lim, S.L.,Liu, R.,Huan, A.C.H. (1999). Characterization of a low-k organic spin-on-glass as an intermetal dielectric. Surface and Interface Analysis 28 (1) : 97-100. ScholarBank@NUS Repository. https://doi.org/10.1002/(SICI)1096-9918(199908)28:13.0.CO;2-M
Abstract: In this paper, we used Fourier transform infrared spectroscopy (FTIR) to study the curing process and thermal stability of a low-k organic SOG (spin-on glass), methyl silsesquioxane (MSQ). The solvent was completely driven out and the MSQ had a high degree of cross-linking after baking. Curing at a higher temperature causes further cross-linking. We also studied the effect of additional treatment processes, such as electron beam and ion implantation, in order to increase the resistance of the MSQ to oxygen plasma ashing. The FTIR spectra and SIMS data of these treated samples before and after oxygen plasma ashing are presented. We also measured the refractive indices and the thicknesses of the samples before and after the electron beam/ion treatment to study the properties of the films.
Source Title: Surface and Interface Analysis
URI: http://scholarbank.nus.edu.sg/handle/10635/95955
ISSN: 01422421
DOI: 10.1002/(SICI)1096-9918(199908)28:13.0.CO;2-M
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

Page view(s)

47
checked on Jun 1, 2018

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.