Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/94187
Title: Measurement of Tg in epoxy resins by DSC - effects of residual stress
Authors: Wang, H. 
Siow, K.S. 
Issue Date: Mar-1999
Source: Wang, H.,Siow, K.S. (1999-03). Measurement of Tg in epoxy resins by DSC - effects of residual stress. Polymer Engineering and Science 39 (3) : 422-429. ScholarBank@NUS Repository.
Abstract: Differences in the glass transition temperatures (Tg) of epoxy resins were observed when their samples for differential scanning calorimetry (DSC) measurements were prepared by two different methods. The differences (in Tg) are believed to be due to the effects of interfacial residual stress, which is present only in the samples of lower Tg prepared with the formation of a `chemical' contact between epoxy resin and aluminum (pan) which have mismatched thermal expansion coefficients. Both types of the samples also showed, respectively, lower Tg when they were prepared by a fast-cooling process than when they were prepared by a slow-cooling process. This suggests that matrix residual stress, which is present in both types of the samples, as well as interfacial residual stress, has similar effects on the Tg of epoxy resins. This conclusion is substantiated by the results of the change of contact pattern and the freezing stress experiments.
Source Title: Polymer Engineering and Science
URI: http://scholarbank.nus.edu.sg/handle/10635/94187
ISSN: 00323888
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

Page view(s)

39
checked on Feb 17, 2018

Google ScholarTM

Check


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.