Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/92831
DC FieldValue
dc.titlePropagation of interface edge cracks by mechanical and thermal strains
dc.contributor.authorHin Wong, W.
dc.contributor.authorCheng, L.
dc.contributor.authorZhang, Y.-W.
dc.date.accessioned2014-10-16T03:08:57Z
dc.date.available2014-10-16T03:08:57Z
dc.date.issued1999
dc.identifier.citationHin Wong, W.,Cheng, L.,Zhang, Y.-W. (1999). Propagation of interface edge cracks by mechanical and thermal strains. American Society of Mechanical Engineers, EEP 26 : 2/-. ScholarBank@NUS Repository.
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/92831
dc.description.abstractComputer simulations of decohesion along one of the interfaces between a thin ductile metal layer and elastic substrates are carried out by using a finite element method. The layer is taken to be elastic-plastic and the fracture process zone has separation characteristics that follow a traction-separation law. This law is characterized by the peak separation stress σ and work of separation per unit area Γ0. The effects of thermal loading rate, the layer thickness and layer-substrate modulus mismatch on the steady-state interface toughness, plastic zone size and shape are investigated. Our simulation results show that the heating process is more critical than the cooling process. Both thin film thickness and elastic mismatch between the film and substrates have marked effects on the steady-state toughness.
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentMECHANICAL & PRODUCTION ENGINEERING
dc.description.sourcetitleAmerican Society of Mechanical Engineers, EEP
dc.description.volume26
dc.description.page2/-
dc.description.codenEEAEE
dc.identifier.isiutNOT_IN_WOS
Appears in Collections:Staff Publications

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