Please use this identifier to cite or link to this item: https://doi.org/10.1021/la0013547
Title: Thermal imidization of fluorinated poly(amic acid)s on Si(100) surfaces modified by plasma polymerization and deposition of glycidyl methacrylate
Authors: Zhang, Y. 
Tan, K.L. 
Liaw, B.Y.
Liaw, D.J.
Kang, E.T. 
Neoh, K.G. 
Issue Date: 3-Apr-2001
Source: Zhang, Y., Tan, K.L., Liaw, B.Y., Liaw, D.J., Kang, E.T., Neoh, K.G. (2001-04-03). Thermal imidization of fluorinated poly(amic acid)s on Si(100) surfaces modified by plasma polymerization and deposition of glycidyl methacrylate. Langmuir 17 (7) : 2265-2274. ScholarBank@NUS Repository. https://doi.org/10.1021/la0013547
Abstract: Plasma polymerization of glycidyl methacrylate (GMA) on pristine and plasma-pretreated Si(100) surfaces was carried out. The epoxide functional groups of the plasma-polymerized GMA (pp-GMA) could be preserved, to a large extent, by controlling the glow discharge parameters. The pp-GMA film was used as an adhesion promotion layer for the thermal imidization of fluorinated poly(amic acid) (FPAA) precursors on Si substrates. The fluorinated polyimide (FPI)/pp-GMA-Si laminates so formed exhibited a 180°-peel adhesion strength as high as 10 N/cm. This value was much higher than the negligible adhesion strength for the FPI/Si laminates obtained from thermal imidization of the FPAAs on either the pristine or the argon-plasma-treated Si surfaces. The high adhesion strengths of the FPI/pp-GMA-Si laminates were attributed to the synergistic effect of coupling the curing of the epoxide groups in the pp-GMA layer with the imidization process of the FPAAs and the fact that the plasma-deposited GMA chains were covalently tethered on the Si(100) surface. Comparison of the adhesion strengths of the FPI/pp-GMA-Si laminates to that of the polyimide (PI)/pp-GMA-Si laminate, formed by thermal imidization of the poly(amic acid) precursor of poly(pyromellitic dianhydride-co-4,4'-oxydianiline) on pp-GMA-Si, suggests that the presence of fluorine-containing groups, such as -CF3, in the PI chains has a negligible effect on the adhesion property of the FPIs on the Si(100) wafer surface modified by the present interfacial molecular design and lamination technique.
Source Title: Langmuir
URI: http://scholarbank.nus.edu.sg/handle/10635/92441
ISSN: 07437463
DOI: 10.1021/la0013547
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