Please use this identifier to cite or link to this item: https://doi.org/10.1163/156856101750430459
Title: Surface modification of poly(tetrafluoroethylene) films by plasma polymerization and UV-induced graft copolymerization for adhesion enhancement with electrolessly-deposited copper
Authors: Yang, G.H.
Kang, E.T. 
Neoh, K.G. 
Keywords: Adhesion
Copper
Electroless plating
Glycidyl methacrylate
Plasma polymerization
PTFE
UV-induced graft copolymerization
Issue Date: 2001
Source: Yang, G.H., Kang, E.T., Neoh, K.G. (2001). Surface modification of poly(tetrafluoroethylene) films by plasma polymerization and UV-induced graft copolymerization for adhesion enhancement with electrolessly-deposited copper. Journal of Adhesion Science and Technology 15 (6) : 727-746. ScholarBank@NUS Repository. https://doi.org/10.1163/156856101750430459
Abstract: Surface modification of H2 plasma-pretreated poly(tetrafluoroethylene) (PTFE) films, either by plasma polymerization and deposition of GMA, or by UV-induced graft copolymerization with glycidyl methacrylate (GMA), was carried out for adhesion enhancement with the electrolessly-deposited copper. XPS and FTIR results revealed that the epoxide groups in the plasma-polymerized GMA (pp-GMA) layer had been preserved to various extents, depending on the glow discharge conditions. The T-peel adhesion test results showed that the adhesion strengths of the electrolessly-deposited copper on both the pp-GMA modified PTFE (pp-GMA-PTFE) film and the GMA graft-copolymerized PTFE (GMA-g-PTFE) film were much higher than that of the electrolessly-deposited copper on the pristine or the H2 plasma-treated PTFE film. The high adhesion strength between the electrolessly-deposited copper and the surface-modified PTFE film was attributed to the fact that the plasma-polymerized and the UV graft-copolymerized GMA chains were covalently tethered on the H2 plasma-pretreated PTFE surface, as well as the fact that these GMA chains were spatially and interactively distributed into the copper matrix.
Source Title: Journal of Adhesion Science and Technology
URI: http://scholarbank.nus.edu.sg/handle/10635/92373
ISSN: 01694243
DOI: 10.1163/156856101750430459
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