Please use this identifier to cite or link to this item:
https://doi.org/10.1016/j.colsurfa.2004.05.030
DC Field | Value | |
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dc.title | Ultra-thin composite films from polyimide and electroactive polymer through covalent molecular assembly | |
dc.contributor.author | Zhang, F. | |
dc.contributor.author | Srinivasan, M.P. | |
dc.date.accessioned | 2014-10-09T07:08:49Z | |
dc.date.available | 2014-10-09T07:08:49Z | |
dc.date.issued | 2005-05-05 | |
dc.identifier.citation | Zhang, F., Srinivasan, M.P. (2005-05-05). Ultra-thin composite films from polyimide and electroactive polymer through covalent molecular assembly. Colloids and Surfaces A: Physicochemical and Engineering Aspects 257-258 : 509-514. ScholarBank@NUS Repository. https://doi.org/10.1016/j.colsurfa.2004.05.030 | |
dc.identifier.issn | 09277757 | |
dc.identifier.uri | http://scholarbank.nus.edu.sg/handle/10635/90759 | |
dc.description.abstract | Soluble polyimide with hydroxyl pendant groups (HPI) and poly(thiophene-3-acetic acid) (PTAA) were synthesized and used to fabricate a composite film through layer-by-layer (LBL) molecular assembly. The interlayer linkage is established through esters formed between the hydroxyls from HPI and carboxylate groups from PTAA. The LBL assembly was carried out on a quartz slide or silicon wafer surface-modified with 3-aminopropyltrimethoxysilane. Fourier-transform infrared (FT-IR) spectroscopy and X-ray photoelectron spectroscopy (XPS) analyses both confirmed the occurrence of interlayer covalent bonding. Linear increase in UV-vis absorption confirmed LBL growth of the film. After 6-bilayer construction, the composite film showed a reduced surface resistivity compared with that of the bare quartz slide and HPI cast film. Exposure to iodine vapor resulted in a further reduction in surface resistivity of the composite film. The film also showed good thermal stability. © 2004 Elsevier B.V. All rights reserved. | |
dc.description.uri | http://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.colsurfa.2004.05.030 | |
dc.source | Scopus | |
dc.subject | Covalent interlayer linkage | |
dc.subject | Improved stability | |
dc.subject | Layer-by-layer assembly | |
dc.subject | Reduced resistivity | |
dc.subject | Ultra-thin film | |
dc.type | Conference Paper | |
dc.contributor.department | CHEMICAL & BIOMOLECULAR ENGINEERING | |
dc.description.doi | 10.1016/j.colsurfa.2004.05.030 | |
dc.description.sourcetitle | Colloids and Surfaces A: Physicochemical and Engineering Aspects | |
dc.description.volume | 257-258 | |
dc.description.page | 509-514 | |
dc.description.coden | CPEAE | |
dc.identifier.isiut | 000228321500094 | |
Appears in Collections: | Staff Publications |
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