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|Title:||Ultra-thin composite films from polyimide and electroactive polymer through covalent molecular assembly|
|Keywords:||Covalent interlayer linkage|
|Citation:||Zhang, F., Srinivasan, M.P. (2005-05-05). Ultra-thin composite films from polyimide and electroactive polymer through covalent molecular assembly. Colloids and Surfaces A: Physicochemical and Engineering Aspects 257-258 : 509-514. ScholarBank@NUS Repository. https://doi.org/10.1016/j.colsurfa.2004.05.030|
|Abstract:||Soluble polyimide with hydroxyl pendant groups (HPI) and poly(thiophene-3-acetic acid) (PTAA) were synthesized and used to fabricate a composite film through layer-by-layer (LBL) molecular assembly. The interlayer linkage is established through esters formed between the hydroxyls from HPI and carboxylate groups from PTAA. The LBL assembly was carried out on a quartz slide or silicon wafer surface-modified with 3-aminopropyltrimethoxysilane. Fourier-transform infrared (FT-IR) spectroscopy and X-ray photoelectron spectroscopy (XPS) analyses both confirmed the occurrence of interlayer covalent bonding. Linear increase in UV-vis absorption confirmed LBL growth of the film. After 6-bilayer construction, the composite film showed a reduced surface resistivity compared with that of the bare quartz slide and HPI cast film. Exposure to iodine vapor resulted in a further reduction in surface resistivity of the composite film. The film also showed good thermal stability. © 2004 Elsevier B.V. All rights reserved.|
|Source Title:||Colloids and Surfaces A: Physicochemical and Engineering Aspects|
|Appears in Collections:||Staff Publications|
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