Please use this identifier to cite or link to this item: https://doi.org/10.1021/ie800456b
Title: Investigation into the roles of sulfur-containing amino acids in electroless nickel plating bath
Authors: Wang, K.
Hong, L. 
Liu, Z.-L.
Issue Date: 3-Sep-2008
Citation: Wang, K., Hong, L., Liu, Z.-L. (2008-09-03). Investigation into the roles of sulfur-containing amino acids in electroless nickel plating bath. Industrial and Engineering Chemistry Research 47 (17) : 6517-6524. ScholarBank@NUS Repository. https://doi.org/10.1021/ie800456b
Abstract: Typical sulfur-containing amino acids, cysteine and methionine, were employed as stabilizers in place of lead(II) acetate in the electroless nickel plating (ENP) system. Each of these compounds presents a critical stabilizing concentration of ca. 10-5 mol/L, below which the ENP rate is slightly promoted with increasing concentration but above which it is significantly suppressed. Their role in stabilizing the ENP bath was found to involve inhibition of the anodic reaction of hypophosphite. The chemical adsorption of these two amino acids on active nickel sites at the Ni plating surface was studied via their adsorption on an in situ generated Ni powder. In addition, the stabilization mechanism was investigated by using potentiometry, X-ray photoelectron spectroscopy (XPS), and UV-vis/infrared spectroscopy. Finally, the bath stabilizing capabilities of these two amino acids and the change in ENP properties with time were assessed through a continuous operation comprising four metal-turnover (MTO) runs. © 2008 American Chemical Society.
Source Title: Industrial and Engineering Chemistry Research
URI: http://scholarbank.nus.edu.sg/handle/10635/90595
ISSN: 08885885
DOI: 10.1021/ie800456b
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