Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.jcis.2004.08.029
Title: Simultaneous adsorption of copper ions and humic acid onto an activated carbon
Authors: Chen, J.P. 
Wu, S.
Keywords: Activated carbon
Adsorption
Copper ions
humic acid
Surface properties
Issue Date: 15-Dec-2004
Source: Chen, J.P., Wu, S. (2004-12-15). Simultaneous adsorption of copper ions and humic acid onto an activated carbon. Journal of Colloid and Interface Science 280 (2) : 334-342. ScholarBank@NUS Repository. https://doi.org/10.1016/j.jcis.2004.08.029
Abstract: In this study, simultaneous adsorption of copper ions and humic acid (HA) from Aldrich onto an activated carbon is investigated. It is found that the HA adsorption in the absence of copper decreases as the pH is increased. It leads to a reduction of 34.7% in the specific surface area of carbon. There exists a critical concentration (CC) of HA for copper adsorption. At HA concentrations < CC, a decrease in copper adsorption is observed; however, the HA improves the adsorption at HA concentrations > CC. An increase in ionic strength can enhance the copper uptake; however, zinc and/or cobalt ions have an insignificant influence on copper adsorption. The adsorption is significantly increased by citric acid, whereas addition of EDTA slightly decreases the uptake. An intraparticle diffusion model is successfully used to describe the copper adsorption kinetics. © 2004 Elsevier Inc. All rights reserved.
Source Title: Journal of Colloid and Interface Science
URI: http://scholarbank.nus.edu.sg/handle/10635/90155
ISSN: 00219797
DOI: 10.1016/j.jcis.2004.08.029
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