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Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.jcis.2009.01.011
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dc.titleDendrimer-encapsulated Pt nanoparticles in supercritical medium: Synthesis, characterization, and application to device fabrication
dc.contributor.authorPuniredd, S.R.
dc.contributor.authorYin, C.M.
dc.contributor.authorHooi, Y.S.
dc.contributor.authorLee, P.S.
dc.contributor.authorSrinivasan, M.P.
dc.date.accessioned2014-10-09T06:45:45Z
dc.date.available2014-10-09T06:45:45Z
dc.date.issued2009-04-15
dc.identifier.citationPuniredd, S.R., Yin, C.M., Hooi, Y.S., Lee, P.S., Srinivasan, M.P. (2009-04-15). Dendrimer-encapsulated Pt nanoparticles in supercritical medium: Synthesis, characterization, and application to device fabrication. Journal of Colloid and Interface Science 332 (2) : 505-510. ScholarBank@NUS Repository. https://doi.org/10.1016/j.jcis.2009.01.011
dc.identifier.issn00219797
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/88737
dc.description.abstractIn this work we describe a general method for formation of Pt nanoparticles within an ultrathin film matrix and its application for non-volatile memory (NVM). Our approach involves the formation of Pt nanoparticles within ultrathin film matrix formed by covalent layer-by-layer (LbL) assembly of pyromellitic dianhydride (PMDA) and second generation of polyamidoamine (PAMAM) dendrimer in supercritical carbon dioxide (SCCO2). The hyperbranched component in the film structure serves to confine nanoparticle size and improve distribution. The memory effect and retention capability is demonstrated by means of a metal-insulator semiconductor (MIS) device fabricated using the nanoparticle-laden thin film as the insulating layer. © 2009 Elsevier Inc. All rights reserved.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.jcis.2009.01.011
dc.sourceScopus
dc.subjectCovalent molecular assembly of ultrathin films and MIS device
dc.subjectDendrimer
dc.subjectPt nanoparticles
dc.subjectSupercritical carbon dioxide
dc.typeArticle
dc.contributor.departmentCHEMICAL & BIOMOLECULAR ENGINEERING
dc.description.doi10.1016/j.jcis.2009.01.011
dc.description.sourcetitleJournal of Colloid and Interface Science
dc.description.volume332
dc.description.issue2
dc.description.page505-510
dc.description.codenJCISA
dc.identifier.isiut000264257600032
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