Please use this identifier to cite or link to this item:
Title: Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging
Authors: Mohan Kumar, K.
Kripesh, V.
Tay, A.A.O. 
Issue Date: 2006
Source: Mohan Kumar, K., Kripesh, V., Tay, A.A.O. (2006). Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging. Proceedings - Electronic Components and Technology Conference 2006 : 237-243. ScholarBank@NUS Repository.
Abstract: SAC (SAC) based composite solders functionalized with single-wall carbon nanotubes (SWCNTs), nano particles such as nano-Ni, nano-Mo with various weight proportions ranging from 0.01 wt% to 5 wt% were successfully produced The composite solders with different wt% of nano particle and nanotube addition were synthesized using the sintering technique The microstructural, melting and mechanical properties of the SAC-based composite solders were evaluated as a function of different wt% of SWCNT, nano-Ni, and Nano-Mo. It is observed that SWCNTs are homogeneously distributed at the edges of Ag3Sn compounds that are distributed evenly in the β-Sn solder matrix. Microstructure analysis revealed that the nano Ni and nano Mo particles were transformed to the intermetallic compounds during processing and distributed uniformly throughout the β-Sn solder matrix. The different wt% addition of SWCNTs to SAC engendered a higher tensile strength, higher hardness and better melting characteristics. The nano particle reinforced solders are harder and stronger than the un reinforced counterparts. FE-SEM observations of fractured surfaces, revealed that the failure is ductile in nature. © 2006 IEEE.
Source Title: Proceedings - Electronic Components and Technology Conference
ISBN: 1424401526
ISSN: 05695503
DOI: 10.1109/ECTC.2006.1645653
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.


checked on Mar 6, 2018


checked on Mar 6, 2018

Page view(s)

checked on Feb 25, 2018

Google ScholarTM



Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.