Please use this identifier to cite or link to this item: https://doi.org/10.1109/ECTC.2006.1645653
Title: Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging
Authors: Mohan Kumar, K.
Kripesh, V.
Tay, A.A.O. 
Issue Date: 2006
Citation: Mohan Kumar, K., Kripesh, V., Tay, A.A.O. (2006). Sn-Ag-Cu lead-free composite solders for ultra-fine-pitch wafer-level packaging. Proceedings - Electronic Components and Technology Conference 2006 : 237-243. ScholarBank@NUS Repository. https://doi.org/10.1109/ECTC.2006.1645653
Abstract: SAC (SAC) based composite solders functionalized with single-wall carbon nanotubes (SWCNTs), nano particles such as nano-Ni, nano-Mo with various weight proportions ranging from 0.01 wt% to 5 wt% were successfully produced The composite solders with different wt% of nano particle and nanotube addition were synthesized using the sintering technique The microstructural, melting and mechanical properties of the SAC-based composite solders were evaluated as a function of different wt% of SWCNT, nano-Ni, and Nano-Mo. It is observed that SWCNTs are homogeneously distributed at the edges of Ag3Sn compounds that are distributed evenly in the β-Sn solder matrix. Microstructure analysis revealed that the nano Ni and nano Mo particles were transformed to the intermetallic compounds during processing and distributed uniformly throughout the β-Sn solder matrix. The different wt% addition of SWCNTs to SAC engendered a higher tensile strength, higher hardness and better melting characteristics. The nano particle reinforced solders are harder and stronger than the un reinforced counterparts. FE-SEM observations of fractured surfaces, revealed that the failure is ductile in nature. © 2006 IEEE.
Source Title: Proceedings - Electronic Components and Technology Conference
URI: http://scholarbank.nus.edu.sg/handle/10635/86080
ISBN: 1424401526
ISSN: 05695503
DOI: 10.1109/ECTC.2006.1645653
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