Please use this identifier to cite or link to this item: https://doi.org/10.1109/ICEPT-HDP.2012.6474744
Title: Modeling of delamination in IC packages
Authors: Tay, A.A.O. 
Issue Date: 2012
Source: Tay, A.A.O. (2012). Modeling of delamination in IC packages. ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging : 854-860. ScholarBank@NUS Repository. https://doi.org/10.1109/ICEPT-HDP.2012.6474744
Abstract: When plastic-encapsulated packages undergo solder reflow after being subjected to moisture preconditioning, hygrothermal stresses are induced in the package. If these stresses are excessive popcorning failure will occur. It has been shown that popcorning failure is usually preceeded by delamination of interfaces in the package. The fracture mechanics approach has been successfully applied by the author to analyse 2D and 3D delaminations in plastic-encapsulated IC packages. In this paper, the author will review some case studies and key findings. © 2012 IEEE.
Source Title: ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging
URI: http://scholarbank.nus.edu.sg/handle/10635/86027
ISBN: 9781467316804
DOI: 10.1109/ICEPT-HDP.2012.6474744
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