Please use this identifier to cite or link to this item: https://doi.org/10.1109/ITHERM.2010.5501362
Title: Experimental investigation of oblique finned microchannel heat sink +
Authors: Lee, Y.-J.
Lee, P.-S. 
Chou, S.-K. 
Keywords: Electronic cooling
Enhanced microchannel
Oblique fins
Thermal management
Issue Date: 2010
Source: Lee, Y.-J.,Lee, P.-S.,Chou, S.-K. (2010). Experimental investigation of oblique finned microchannel heat sink +. 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010 : -. ScholarBank@NUS Repository. https://doi.org/10.1109/ITHERM.2010.5501362
Abstract: Sectional oblique fins are employed in contrast to the continuous fins in order to modulate the flow in microchannel heat sink. The breakage of continuous fin into oblique sections causes the thermal boundary layers to be re-initialized at the leading edge of each oblique fin and reduces the boundary-layer thickness. This regeneration of the entrance effect causes the flow to be always in a developing state thus resulting in better heat transfer. In addition, the presence of the smaller oblique channels causes a fraction of the flow to branch into the adjacent main channels. The secondary flows thus created improve fluid mixing which serves to further enhance the heat transfer. Experimental investigation employing copper based microchannels demonstrated that the combination of the re-entrance and secondary flow effect from oblique fins results in a much improved heat transfer performance against the conventional microchannel. The average Nusselt number, Nuave, for the copper microchannel heat sink which uses water as the working fluid can increase as much as 80%, from 8.6 to 15.8. The augmented convective heat transfer leads to 18% reduction in the total thermal resistance, while the maximum base temperature rise above inlet fluid temperature decreases 9.3°C, from 50.0°C to 40.7°C. Interestingly, there is only little or negligible pressure drop penalty associated with this novel heat transfer enhancement scheme in contrast to conventional enhancement techniques. ©2010 IEEE.
Source Title: 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
URI: http://scholarbank.nus.edu.sg/handle/10635/85963
ISBN: 9781424453429
DOI: 10.1109/ITHERM.2010.5501362
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