Please use this identifier to cite or link to this item: https://doi.org/10.1109/EPTC.2008.4763510
Title: Effect of type of reinforcement at nanolength scale on the tensile properties of Sn-0.7Cu solder alloy
Authors: Zhong, X.L. 
Gupta, M. 
Issue Date: 2008
Citation: Zhong, X.L., Gupta, M. (2008). Effect of type of reinforcement at nanolength scale on the tensile properties of Sn-0.7Cu solder alloy. 10th Electronics Packaging Technology Conference, EPTC 2008 : 669-674. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2008.4763510
Abstract: In this study, Sn-0.7Cu solder alloy was reinforced with A1 2O3 (50nm) and ZrO2 (45nm) nano particulates to form Sn-0.7Cu/Al2O3 and Sn-0.7Cu/ZrO2 composites. The volume percentage of the A12O3 and ZrO2 nanoparticulates reinforcement was kept at 1.5%. The composites were synthesized using powder metallurgy technique assisted with microwave sintering and incorporating hot extrusion as secondary processing technique. The extruded materials were characterized in terms of microstructural, physical and mechanical properties. The density values of composite solder materials were found to be lower when compared to monolithic alloy. Microstructure characterization revealed bigger pores in Sn-0.7Cu/ZrO2 composite samples compared to Sn-0.7Cu/Al2O3 composite samples. The results of room temperature tensile testing revealed that 0.2% yield strength and ultimate tensile strength of composite solder materials increased when compared to monolithic solder. Among the composite solders, the 0.2% yield strength and ultimate tensile strength of Sn-0.7Cu/Al2O3 composite was found to be distinctly superior to Sn-0.7Cu/ZrO2 composite. © 2008 IEEE.
Source Title: 10th Electronics Packaging Technology Conference, EPTC 2008
URI: http://scholarbank.nus.edu.sg/handle/10635/85946
ISBN: 9781424421183
DOI: 10.1109/EPTC.2008.4763510
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