Please use this identifier to cite or link to this item:
https://doi.org/10.1109/TMAG.2007.893801
DC Field | Value | |
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dc.title | Effect of sputtered seed layer on electrodeposited NiFe/Cu composite wires | |
dc.contributor.author | Li, X.P. | |
dc.contributor.author | Yi, J.B. | |
dc.contributor.author | Seet, H.L. | |
dc.contributor.author | Yin, J.H. | |
dc.contributor.author | Thongmee, S. | |
dc.contributor.author | Ding, J. | |
dc.date.accessioned | 2014-10-07T09:14:01Z | |
dc.date.available | 2014-10-07T09:14:01Z | |
dc.date.issued | 2007-06 | |
dc.identifier.citation | Li, X.P., Yi, J.B., Seet, H.L., Yin, J.H., Thongmee, S., Ding, J. (2007-06). Effect of sputtered seed layer on electrodeposited NiFe/Cu composite wires. IEEE Transactions on Magnetics 43 (6) : 2983-2985. ScholarBank@NUS Repository. https://doi.org/10.1109/TMAG.2007.893801 | |
dc.identifier.issn | 00189464 | |
dc.identifier.uri | http://scholarbank.nus.edu.sg/handle/10635/85943 | |
dc.description.abstract | In this paper, a seed-layer approach to electrodeposition of Ni 80Fe20 on Cu wires was developed. First, different thicknesses of Ni80Fe20 were directly deposited onto the Cu wires by sputtering as a seed layer. A rotation L-holder fixture was used to hold the Cu wire during sputtering. Second, a relatively thick Ni 80Fe20 layer was deposited by electrodeposition onto the Cu wire with the seed layer by sputtering. The results of surface characterization on the composite wires with a seed layer showed that the surface uniformity was greatly improved, as compared to the surfaces of electrodeposited wires without a seed layer. A low coercivity of 0.5 Oe for the composite wire with a seed layer was achieved. The electrodeposited wires with seed layers performed an enhanced MI effect of 250%, in contrast to the MI effect of 160% as achieved by electrodeposited wires without a seed layer. © 2007 IEEE. | |
dc.description.uri | http://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/TMAG.2007.893801 | |
dc.source | Scopus | |
dc.subject | Electrodeposition | |
dc.subject | MI | |
dc.subject | NiFe/Cu | |
dc.subject | Sputtering | |
dc.type | Conference Paper | |
dc.contributor.department | MATERIALS SCIENCE AND ENGINEERING | |
dc.contributor.department | MECHANICAL ENGINEERING | |
dc.description.doi | 10.1109/TMAG.2007.893801 | |
dc.description.sourcetitle | IEEE Transactions on Magnetics | |
dc.description.volume | 43 | |
dc.description.issue | 6 | |
dc.description.page | 2983-2985 | |
dc.description.coden | IEMGA | |
dc.identifier.isiut | 000246706200297 | |
Appears in Collections: | Staff Publications |
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