Please use this identifier to cite or link to this item: https://doi.org/10.1109/TMAG.2007.893801
Title: Effect of sputtered seed layer on electrodeposited NiFe/Cu composite wires
Authors: Li, X.P. 
Yi, J.B. 
Seet, H.L. 
Yin, J.H.
Thongmee, S. 
Ding, J. 
Keywords: Electrodeposition
MI
NiFe/Cu
Sputtering
Issue Date: Jun-2007
Source: Li, X.P., Yi, J.B., Seet, H.L., Yin, J.H., Thongmee, S., Ding, J. (2007-06). Effect of sputtered seed layer on electrodeposited NiFe/Cu composite wires. IEEE Transactions on Magnetics 43 (6) : 2983-2985. ScholarBank@NUS Repository. https://doi.org/10.1109/TMAG.2007.893801
Abstract: In this paper, a seed-layer approach to electrodeposition of Ni 80Fe20 on Cu wires was developed. First, different thicknesses of Ni80Fe20 were directly deposited onto the Cu wires by sputtering as a seed layer. A rotation L-holder fixture was used to hold the Cu wire during sputtering. Second, a relatively thick Ni 80Fe20 layer was deposited by electrodeposition onto the Cu wire with the seed layer by sputtering. The results of surface characterization on the composite wires with a seed layer showed that the surface uniformity was greatly improved, as compared to the surfaces of electrodeposited wires without a seed layer. A low coercivity of 0.5 Oe for the composite wire with a seed layer was achieved. The electrodeposited wires with seed layers performed an enhanced MI effect of 250%, in contrast to the MI effect of 160% as achieved by electrodeposited wires without a seed layer. © 2007 IEEE.
Source Title: IEEE Transactions on Magnetics
URI: http://scholarbank.nus.edu.sg/handle/10635/85943
ISSN: 00189464
DOI: 10.1109/TMAG.2007.893801
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