Please use this identifier to cite or link to this item:
|Title:||Effect of sputtered seed layer on electrodeposited NiFe/Cu composite wires|
|Authors:||Li, X.P. |
|Citation:||Li, X.P., Yi, J.B., Seet, H.L., Yin, J.H., Thongmee, S., Ding, J. (2007-06). Effect of sputtered seed layer on electrodeposited NiFe/Cu composite wires. IEEE Transactions on Magnetics 43 (6) : 2983-2985. ScholarBank@NUS Repository. https://doi.org/10.1109/TMAG.2007.893801|
|Abstract:||In this paper, a seed-layer approach to electrodeposition of Ni 80Fe20 on Cu wires was developed. First, different thicknesses of Ni80Fe20 were directly deposited onto the Cu wires by sputtering as a seed layer. A rotation L-holder fixture was used to hold the Cu wire during sputtering. Second, a relatively thick Ni 80Fe20 layer was deposited by electrodeposition onto the Cu wire with the seed layer by sputtering. The results of surface characterization on the composite wires with a seed layer showed that the surface uniformity was greatly improved, as compared to the surfaces of electrodeposited wires without a seed layer. A low coercivity of 0.5 Oe for the composite wire with a seed layer was achieved. The electrodeposited wires with seed layers performed an enhanced MI effect of 250%, in contrast to the MI effect of 160% as achieved by electrodeposited wires without a seed layer. © 2007 IEEE.|
|Source Title:||IEEE Transactions on Magnetics|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Jul 14, 2018
WEB OF SCIENCETM
checked on Jun 19, 2018
checked on Jul 6, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.