Please use this identifier to cite or link to this item: https://doi.org/10.1109/EPTC.2007.4469839
Title: Dynamic testing of solder joint strength under compression, tension and shearing
Authors: Liu, J.F. 
Shim, V.P.W. 
Tan, V.B.C. 
Lee, T.K.
Issue Date: 2007
Citation: Liu, J.F., Shim, V.P.W., Tan, V.B.C., Lee, T.K. (2007). Dynamic testing of solder joint strength under compression, tension and shearing. Proceedings of the Electronic Packaging Technology Conference, EPTC : 380-385. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2007.4469839
Abstract: Studies on strain rate sensitivity of solder joints at high rates are relatively scarce. This investigation explores the possibility of establishing an experimental technique using a split Hopkinson bar to test single solder specimens. Computational simulation of tests on a cylindrical specimen the size of the solder ball is also performed to validate the assumption of one dimensional wave propagation as well as accuracy of stress-strain data derived. Tests on actual 0.24mm diameter solder balls show good repeatability of results, confirming the feasibility of applying the SHB technique. Average dynamic stress-strain curves for strain rates ranging from 102/s to 10 3/s were obtained and compared with average responses corresponding to quasi-static strain rates of 10-3 /s and 1/s for compression, tension and shear loading. Rate sensitivity of the solder ball response is observed. © 2007 IEEE.
Source Title: Proceedings of the Electronic Packaging Technology Conference, EPTC
URI: http://scholarbank.nus.edu.sg/handle/10635/85933
ISBN: 1424413249
DOI: 10.1109/EPTC.2007.4469839
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