Please use this identifier to cite or link to this item: https://doi.org/10.1115/IMECE2008-66309
Title: Development of lead-free nanocomposite solders using oxide based reinforcement
Authors: Babaghorbani, P.
Nai, S.M.L.
Gupta, M. 
Issue Date: 2009
Citation: Babaghorbani, P.,Nai, S.M.L.,Gupta, M. (2009). Development of lead-free nanocomposite solders using oxide based reinforcement. ASME International Mechanical Engineering Congress and Exposition, Proceedings 15 : 89-93. ScholarBank@NUS Repository. https://doi.org/10.1115/IMECE2008-66309
Abstract: In this study, Sn.3.5Ag/SnO2 nanocomposite solders are developed. Composites with 0.7 and 1.0 volume percentage of tin oxide were synthesized through powder metallurgy route incorporating microwave assisted rapid sintering technique followed by hot extrusion. The extruded specimens were examined in terms of their physical and tensile properties. Tensile characterization studies revealed that 0.2% yield strength and ultimate tensile strength were increased significantly by addition of 0.7 volume percent of nano SnO2 particles. An attempt is made to correlate mechanical properties of Sn-3.5Ag with the presence of SnO2 particles at the nanometer length scale. Copyright © 2008 by ASME.
Source Title: ASME International Mechanical Engineering Congress and Exposition, Proceedings
URI: http://scholarbank.nus.edu.sg/handle/10635/85921
ISBN: 9780791848760
DOI: 10.1115/IMECE2008-66309
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