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Title: Development of 1×4 micro optical switch based on SOI vertical micromirror technology
Authors: Wang, Z.F.
Shan, X.C.
Wang, Z.P.
Cao, W.Q.
Xu, J.F.
Lim, S.P. 
Noell, W.
De Rooij, N.
Keywords: Deep reactive ion etching (DRIE)
Fiber optical switch
Micro-optical-electro-mechanic system (MOEMS)
Silicon-on-insulator (SOI)
Issue Date: 2003
Source: Wang, Z.F.,Shan, X.C.,Wang, Z.P.,Cao, W.Q.,Xu, J.F.,Lim, S.P.,Noell, W.,De Rooij, N. (2003). Development of 1×4 micro optical switch based on SOI vertical micromirror technology. Proceedings of SPIE - The International Society for Optical Engineering 4983 : 109-113. ScholarBank@NUS Repository.
Abstract: In this paper, the development of a 1×4 micro optical switch utilizing electrostatic actuation and vertical silicon mirrors was reported. This device was fabricated from silicon-on-insulator (SOI) wafer using a bulk micromachming process, which allowed the fabrication of vertical mirrors and U-grooves through deep reactive ion etching (DRIE) of silicon. A few process steps were required in the fabrication. Moreover, the device was patterned in a single lithographic step. A relatively high yield (up to 70%) was achieved during the microfabrication due to this compact process flow. More importantly, the footprint was less than 13mm2. To verify the design, the stress/strain distribution around the actuator was examined using FEM simulation. The relationship between driving voltage and mirror displacement derived from simulation agreed well with the measurement. Tapered lensed singlemode fiber were assembled into U-grooves and positioned passively by fiber stopper. The device was then packaged and pigtailed. Characterization on the mechanical and optical performance of this device show the promising characteristics of this 1×4 optical switch for use in optical networks.
Source Title: Proceedings of SPIE - The International Society for Optical Engineering
ISSN: 0277786X
Appears in Collections:Staff Publications

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