Please use this identifier to cite or link to this item:
|Title:||A numerical study of the effect of die, die pad and die attach thicknesses on thin plastic packages|
|Authors:||Tay, A.A.O. |
|Source:||Tay, A.A.O.,Zhu, H. (2002). A numerical study of the effect of die, die pad and die attach thicknesses on thin plastic packages. Proceedings - Electronic Components and Technology Conference : 199-204. ScholarBank@NUS Repository.|
|Abstract:||In this paper, the effects of thickness of the die (td), die-pad (tp) and die attach (ta) on delaminations in Thin Shrink Small Outline Plastic IC packages were studied. The effects of td and tp on Crack I, II and III are individually investigated where Crack I lies in the pad-encapsulant interface, Crack II in the die-encapsulant interface and Crack III in the pad-die attach interface. A fracture mechanics approach was used to compute the strain energy release rate (ERR) at the crack tips. For the die attach thickness ta, only its effect on Clack III was investigated. According to the literature, the Young's Modulus E of the die attach has a great influence on delamination along the pad-die attach interface. Thus a full factorial analysis of die attach thickness (ta) and Young's Modulus E on Crack III crack tip energy release rate was also carried out. Among other things, it was found that increasing the thickness of the die increases the ERR of cracks at all three interfaces and increasing the thickness of die pad increases the ERR of Crack I and II. It was also found that a smaller Young's Modulus and a greater thickness of the die attach is a good design against propagation of Crack III.|
|Source Title:||Proceedings - Electronic Components and Technology Conference|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Jan 12, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.