Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/85710
Title: Surface roughness measurement of semi-conductor wafers using a modified total integrated scattering model
Authors: Tay, C.J. 
Wang, S.H. 
Quan, C. 
Ng, C.K.
Keywords: Light scattering
Non-contact measurement
Surface roughness
Total integrated scattering (TIS)
Issue Date: 2002
Source: Tay, C.J.,Wang, S.H.,Quan, C.,Ng, C.K. (2002). Surface roughness measurement of semi-conductor wafers using a modified total integrated scattering model. Optik (Jena) 113 (7) : 317-321. ScholarBank@NUS Repository.
Abstract: Light scattering is a non-contact technique which can be used for characterizing the topography of smooth reflecting surfaces. A proposed technique which incorporates a modified Total Integrated Scattering (TIS) model for surface roughness measurement of semi-conductor wafers has been developed. The technique employs a low power He-Ne laser and incorporates conventional optical components to record surface roughness in the nanometer range (Ra < 45 nm) with a high degree of accuracy. Principle of the technique and the experimental arrangement are described. Results obtained using the proposed technique are compared with those using the conventional direct contact method.
Source Title: Optik (Jena)
URI: http://scholarbank.nus.edu.sg/handle/10635/85710
ISSN: 00304026
Appears in Collections:Staff Publications

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