Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.jallcom.2006.10.123
Title: Single-wall carbon nanotube (SWCNT) functionalized Sn-Ag-Cu lead-free composite solders
Authors: Kumar, K.M.
Kripesh, V.
Tay, A.A.O. 
Keywords: Fracture analysis
Hardness
Single-wall carbon nanotubes (SWCNTs)
Sn-3.8Ag-0.7Cu solder alloy
Issue Date: 14-Feb-2008
Citation: Kumar, K.M., Kripesh, V., Tay, A.A.O. (2008-02-14). Single-wall carbon nanotube (SWCNT) functionalized Sn-Ag-Cu lead-free composite solders. Journal of Alloys and Compounds 450 (1-2) : 229-237. ScholarBank@NUS Repository. https://doi.org/10.1016/j.jallcom.2006.10.123
Abstract: Sn-3.8Ag-0.7Cu-based composite solders functionalized with single-wall carbon nanotubes (SWCNTs) with various weight proportions ranging from 0.01 to 1 wt% were successfully produced. The microstuctural, melting and mechanical properties of Sn-3.8Ag-0.7Cu-based composite solders were evaluated as a function of different wt% of SWCNT addition. The microstructures of the composite specimens were studied by means of field-emission scanning electron microscope (FE-SEM). It was observed that SWCNTs were homogeneously distributed at the edges of Ag3Sn compounds that are distributed evenly in the β-Sn solder matrix. Energy dispersion X-ray (EDX) analysis method was employed to reveal the presence of the phases existed in the solder composites. The mechanical properties of the composite solders were evaluated by Vickers-microhardness measurements and tensile tests performed at room temperature. The different wt% and addition of SWCNTs to Sn-3.8Ag-0.7Cu produced a dramatic increase in tensile strength, hardness, and better melting characteristics. A slight decrease in elongation to failure was observed. FE-SEM observations of the fracture surface, revealed the overall failure mechanism as the ductile manner of failure. © 2006 Elsevier B.V. All rights reserved.
Source Title: Journal of Alloys and Compounds
URI: http://scholarbank.nus.edu.sg/handle/10635/85640
ISSN: 09258388
DOI: 10.1016/j.jallcom.2006.10.123
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